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Ray Publish 0.1.0 488447f

CGA1808X7R102K302QT

HRE · Multilayer Ceramic Capacitors MLCC - SMD/SMT · 1808

CGA1808X7R102K302QT from HRE, in a 1808. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1 passive Terminal 1 of an unpolarised capacitor; either orientation.
2 2 passive Terminal 2 of an unpolarised capacitor; either orientation.

Key specifications

Parameter Value
Manufacturer HRE
Package 1808
Category Capacitors
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Nominal capacitance C 1 nF 1
Rated voltage 3000 Vdc 1
Operating temperature range -55 125 ℃ Temperature range as printed on part-number page 1
Temperature characteristic of capacitance (X7R) -15 15 % X7R; capacitance change over -55℃ to +125℃ relative to 25℃ reference 3
Insulation resistance (initial) I.R. 10 GΩ 25℃, between terminals, 1 min, 500 V test (RV>500V), max 50 mA charge current; smaller of ≥10 GΩ or RC≥500 Ω·F 2
Insulation resistance after high-temperature high-humidity test I.R. 500 MΩ 40±2℃, 90-95%RH, 500±24 h; smaller of 500 MΩ or RC≥5 s 5
Insulation resistance after life test (X7R) I.R. 1 GΩ X7R, 1000±12 h at max operating temperature ±3℃, 100% RV; smaller of ≥1 GΩ or RC≥10 s 5
Capacitance change after life test (X7R) ΔC/C -15 15 % X7R, 1000±12 h at max operating temperature ±3℃, 100% RV 5
Capacitance change after high-temperature high-humidity test (X7R) ΔC/C -12.5 12.5 % X7R, 40±2℃, 90-95%RH, 500±24 h; test voltage printed as rated voltage (not exceeding 630V) 5
Capacitance change after temperature cycle (X7R) ΔC/C -15 15 % X7R, 5 cycles, min/max temperature ±3℃, 30±3 min per step, after 150℃ 1 h pretreatment 4
Capacitance change after resistance to soldering heat (X7R) ΔC/C -7.5 7.5 % X7R/X5R/X6S, Sn-3.0Ag-0.5Cu solder bath 260±5℃, 10±1 s, 24 h recovery 4
Capacitance change in substrate bending test (general series) ΔC/C -10 10 % X7R, general series, board bent 1 mm after reflow mounting 3
Dissipation factor after high-temperature high-humidity test (≥25V) D.F. 5 % X7R, ≥25V, 40±2℃, 90-95%RH, 500±24 h; larger of ≤5% or 2× initial value 5
Dissipation factor after life test (≥25V) D.F. 5 % X7R, ≥25V, 1000±12 h at max operating temperature ±3℃, 100% RV; larger of ≤5% or 2× initial value 5
Storage temperature 0 35 ℃ Storage before use 11
Storage relative humidity 70 %RH Storage 11

CAD (KiCad official)

  • Symbol: CGA1808X7R102K302QT
  • Footprint: Capacitor_SMD:C_1808_4520Metric
  • 3D model: 1808 (KiCad packages3D, STEP)
  • 3D model files: cga1808x7r102k302qt-etched.step / cga1808x7r102k302qt-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cga1808x7r102k302qt.step / cga1808x7r102k302qt.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HRE datasheet (15 pp, sha256 c052971b2ac57d49, retrieved 2026-10-14, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins, primary two-terminal convention (convention), consensus off (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF