main
History Download
Ray Publish 0.1.0 9988141 14d ago

CEZ36V

TOSHIBA AMERICA ELECTRONIC COMPONENTS · ESD And Surge Protection (TVS/ESD) · SOD-523

CEZ36V from TOSHIBA AMERICA ELECTRONIC COMPONENTS, in a SOD-523. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Cathode passive Cathode terminal of the CEZ36V Zener diode, with Zener voltage VZ of 34.0 V min, 36 V typ and 38.0 V max at test current IZ = 2 mA.
2 Anode passive Anode terminal of the CEZ36V Zener diode, paired with the cathode (pin 1) for surge and ESD protection, with ESD rated ±12 kV contact/air and peak pulse power of 200 W.

Key specifications

Parameter Value
Manufacturer TOSHIBA AMERICA ELECTRONIC COMPONENTS
Package SOD-523
Category Circuit Protection
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ 34 36 38 V IZ = 2 mA 2
Zener dynamic impedance ZZ 100 Ω IZ = 2 mA 2
Dynamic resistance (TLP) RDYN 2.6 Ω TLP: Z0 = 50 Ω, tp = 100 ns, tr = 300 ps, t1 = 30 ns to t2 = 60 ns, ITLP1 = 16 A to ITLP2 = 30 A 2
Clamp voltage (TLP) VC 63 V ITLP = 16 A 2
Total capacitance Ct 18 pF VR = 0 V, f = 1 MHz 2
Reverse current IR 0.1 μA VR = 32.5 V 2
Power dissipation (mounted on 20 mm × 20 mm glass epoxy board, 4 mm × 4 mm pad) PD 150 mW *1: glass epoxy circuit board 20 mm × 20 mm, pad 4 mm × 4 mm 1
Power dissipation (mounted on 25.4 mm × 25.4 mm × 1.6 mm glass epoxy board, Cu pad 645 mm²) PD 300 mW *2: glass epoxy circuit board 25.4 mm × 25.4 mm × 1.6 mm, Cu pad 645 mm² 1
Junction temperature Tj 150 °C 1
Storage temperature Tstg -55 150 °C 1
Electrostatic discharge voltage VESD -12 12 kV IEC61000-4-2 (contact/air not distinguished in the table) 1
Peak pulse power PPK 200 W IEC61000-4-5, tp = 8/20 μs 1
Peak pulse current IPP 3 A IEC61000-4-5, tp = 8/20 μs 1

CAD (KiCad official)

  • Symbol: CEZ36V
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523 (KiCad packages3D, STEP)
  • 3D model files: cez36v-etched.step / cez36v-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cez36v.step / cez36v.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: TOSHIBA AMERICA ELECTRONIC COMPONENTS datasheet (16 pp, sha256 03308e1c610580c0, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF