component
CESD5V0D3 ZA
Public Made by Adomby adom
Changjing ESD And Surge Protection (TVS/ESD), SOD-323. Unpolarised two-terminal part: the datasheet prints no pin numbers, so pins 1 and 2 follow the library convention, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCESD5V0D3 ZA
Changjing · ESD And Surge Protection (TVS/ESD) · SOD-323
CESD5V0D3 ZA from Changjing, in a SOD-323. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | K | passive | Cathode: the banded/marked end per the datasheet; pad 1 of the KiCad diode footprint. |
| 2 | A | passive | Anode. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Changjing |
| Package | SOD-323 |
| Category | Circuit Protection |
| Pins | 2 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Working Peak Reverse Voltage | VRWM | 5 | V | 2 | |||
| Maximum Reverse Leakage Current | IR | 10 | μA | @ VRWM | 2 | ||
| Breakdown Voltage | VBR | 6.2 | 7.3 | V | @ IT = 1.0 mA | 2 | |
| Clamping Voltage | VC | 9.8 | V | @ IPP = 5 A | 2 | ||
| Clamping Voltage @ Max IPP | VC | 15.5 | V | @ Max IPP | 2 | ||
| Maximum Reverse Peak Pulse Current | IPP | 15 | A | Surge waveform per Figure 6 | 2 | ||
| Peak Power Dissipation | Ppk | 350 | W | Surge waveform per Figure 6 | 2 | ||
| Forward Voltage | VF | 0.9 | V | @ IF = 10 mA | 2 | ||
| Capacitance | C | 350 | pF | VR=0, f=1MHz | 2 | ||
| IEC61000-4-2 ESD Air | -15 | 15 | KV | Air, Ta=25℃ | 1 | ||
| IEC61000-4-2 ESD Contact | -8 | 8 | KV | Contact, Ta=25℃ | 1 | ||
| ESD Voltage per human body model | 30 | KV | Ta=25℃ | 1 | |||
| Total Power Dissipation on FR-5 Board | PD | 200 | mW | Note 1, Ta=25℃ | 1 | ||
| Lead Solder Temperature | TL | 260 | ℃ | 10 Second Duration | 1 | ||
| Junction and Storage Temperature Range | Tj, Tstg | -55 | 150 | ℃ | 1 | ||
| Thermal Resistance Junction-to-Ambient | RΘJA | 625 | ℃/W | 1 |
CAD (KiCad official)
- Symbol:
CESD5V0D3 ZA - Footprint:
Diode_SMD:D_SOD-323 - 3D model: SOD-323 (KiCad packages3D, STEP)
- 3D model files:
cesd5v0d3-za-etched.step/cesd5v0d3-za-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cesd5v0d3-za.step/cesd5v0d3-za.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Changjing datasheet (2 pp, sha256
43c44a24b8271dc1, retrieved 2026-10-22, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins, primarycathode-band convention(convention), consensusoff(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).