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CES2321A-VB

VBsemi Elec · MOSFETs · SOT-23(TO-236)

CES2321A-VB from VBsemi Elec, in a SOT-23(TO-236). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 G input Gate; gate-source voltage limit is ±12 V, with threshold VGS(th) of -0.5 V to -1.5 V at ID = -250 µA.
2 S passive Source of the P-channel MOSFET; continuous body-diode source-drain current is -2.1 A at TC = 25 °C.
3 D passive Drain; drain-source voltage rating is -20 V, with RDS(on) of 0.060 Ω at VGS = -10 V and ID = -3 A.

Key specifications

Parameter Value
Manufacturer VBsemi Elec
Package SOT-23(TO-236)
Category Triode/MOS Tube/Transistor
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Drain-Source Breakdown Voltage VDS -20 V VDS = 0 V, ID = - 250 µA 2
Gate-Source Threshold Voltage VGS(th) -0.5 -1.5 V VDS = VGS, ID = - 250 µA 2
Gate-Source Leakage IGSS 100 nA VDS = 0 V, VGS = ± 12 V 2
Zero Gate Voltage Drain Current IDSS -1 µA VDS = - 20 V, VGS = 0 V 2
Zero Gate Voltage Drain Current (TJ = 55 °C) IDSS -10 µA VDS = - 20 V, VGS = 0 V, TJ = 55 °C 2
On-State Drain Current ID(on) -10 A VDS - 5 V, VGS = - 4.5 V 2
Drain-Source On-State Resistance RDS(on) 0.06 Ω VGS = - 10 V, ID = - 3 A 2
Drain-Source On-State Resistance RDS(on) 0.065 Ω VGS = - 4.5 V, ID = - 2.5 A 2
Drain-Source On-State Resistance RDS(on) 0.08 Ω VGS = - 2.5 V, ID = - 2 A 2
Gate Resistance Rg 0.9 4.4 8.8 Ω f = 1 MHz 2
Turn-On Delay Time td(on) 22 33 ns VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Rise Time tr 20 30 ns VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Turn-Off Delay Time td(off) 28 42 ns VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Fall Time tf 9 18 ns VDD = - 10 V, RL = 2.4 Ω, ID = - 3.1 A, VGEN = - 4.5 V, Rg = 1 Ω 2
Continuous Source-Drain Diode Current IS -2.1 A TC = 25 °C 2
Pulse Diode Forward Current ISM -10 A 2
Body Diode Voltage VSD -0.8 -1.2 V IS = - 3.1 A 2
Body Diode Reverse Recovery Time trr 23 35 ns IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Body Diode Reverse Recovery Charge Qrr 12 20 nC IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Drain-Source Voltage VDS -20 V TA = 25 °C 1
Gate-Source Voltage VGS -12 12 V TA = 25 °C 1
Continuous Drain Current ID -4 A TC = 25 °C, TJ = 150 °C 1
Continuous Drain Current ID -3.2 A TC = 70 °C, TJ = 150 °C 1
Continuous Drain Current ID -3.5 A TA = 25 °C, TJ = 150 °C 1
Continuous Drain Current ID -2.5 A TA = 70 °C, TJ = 150 °C 1
Pulsed Drain Current IDM -10 A 1
Continuous Source-Drain Diode Current IS -2.1 A TC = 25 °C 1
Continuous Source-Drain Diode Current IS -1 A TA = 25 °C 1
Maximum Power Dissipation PD 2.5 W TC = 25 °C 1
Maximum Power Dissipation PD 1.6 W TC = 70 °C 1
Maximum Power Dissipation PD 1.25 W TA = 25 °C 1
Maximum Power Dissipation PD 0.8 W TA = 70 °C 1
Operating Junction and Storage Temperature Range TJ, Tstg -55 150 °C 1
Maximum Junction-to-Ambient RthJA 75 100 °C/W t = 5 s, surface mounted on 1" x 1" FR4 board 1
Maximum Junction-to-Foot (Drain) RthJF 40 50 °C/W Steady State 1
VDS Temperature Coefficient ΔVDS/TJ 13.4 mV/°C ID = - 250 µA 2
VGS(th) Temperature Coefficient ΔVGS(th)/TJ 2.9 mV/°C ID = - 250 µA 2
Forward Transconductance gfs 15 S VDS = - 5 V, ID = - 3 A 2
Input Capacitance Ciss 835 pF VDS = - 10 V, VGS = 0 V, f = 1 MHz 2
Output Capacitance Coss 180 pF VDS = - 10 V, VGS = 0 V, f = 1 MHz 2
Reverse Transfer Capacitance Crss 155 pF VDS = - 10 V, VGS = 0 V, f = 1 MHz 2
Total Gate Charge Qg 10 nC VDS = - 10 V, VGS = - 4.5 V, ID = - 3.1 A 2
Total Gate Charge Qg 6.4 nC VDS = - 10 V, VGS = - 2.5 V, ID = - 3.1 A 2
Gate-Source Charge Qgs 1.7 nC 2
Gate-Drain Charge Qgd 3.4 nC 2
Reverse Recovery Fall Time ta 15 ns IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2
Reverse Recovery Rise Time tb 8 ns IF = - 3.1 A, dI/dt = 100 A/µs, TJ = 25 °C 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: CES2321A-VB
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236), generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: ces2321a-vb-etched.step / ces2321a-vb-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ces2321a-vb.step / ces2321a-vb.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: VBsemi Elec datasheet (9 pp, sha256 a42ba9ed77a116e4, retrieved 2026-11-13, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF