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Ray Publish 0.1.0 1491b3c 11d ago

CD74HCT241M96

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-20-300mil

CD74HCT241M96 from Texas Instruments, in a SOIC-20-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-low output enable for the group 1 buffers (1Y0 to 1Y3) of the '241.
2 1A0 input Group 1 buffer data input 0, non-inverting to 1Y0.
3 2Y3 tri_state Group 2 three-state buffer output 3, non-inverting from 2A3.
4 1A1 input Group 1 buffer data input 1, non-inverting to 1Y1.
5 2Y2 tri_state Group 2 three-state buffer output 2, non-inverting from 2A2.
6 1A2 input Group 1 buffer data input 2, non-inverting to 1Y2.
7 2Y1 tri_state Group 2 three-state buffer output 1, non-inverting from 2A1.
8 1A3 input Group 1 buffer data input 3, non-inverting to 1Y3.
9 2Y0 tri_state Group 2 three-state buffer output 0, non-inverting from 2A0.
10 GND power_in Ground.
11 2A0 input Group 2 buffer data input 0, non-inverting to 2Y0.
12 1Y3 tri_state Group 1 three-state buffer output 3, non-inverting from 1A3.
13 2A1 input Group 2 buffer data input 1, non-inverting to 2Y1.
14 1Y2 tri_state Group 1 three-state buffer output 2, non-inverting from 1A2.
15 2A2 input Group 2 buffer data input 2, non-inverting to 2Y2.
16 1Y1 tri_state Group 1 three-state buffer output 1, non-inverting from 1A1.
17 2A3 input Group 2 buffer data input 3, non-inverting to 2Y3.
18 1Y0 tri_state Group 1 three-state buffer output 0, non-inverting from 1A0.
19 2OE input Active-high output enable for the group 2 buffers (2Y0 to 2Y3) of the '241.
20 VCC power_in Supply voltage; HCT types operate from 4.5 V to 5.5 V, with a 0.1-µF bypass capacitor recommended close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-20-300mil
Category Logic
Pins 20

CAD (KiCad official)

  • Symbol: CD74HCT241M96
  • Footprint: Package_SO:SOIC-20W_7.5x12.8mm_P1.27mm
  • 3D model: SOIC-20-300mil (KiCad packages3D, STEP)
  • 3D model files: cd74hct241m96-etched.step / cd74hct241m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hct241m96.step / cd74hct241m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (32 pp, sha256 cf7e141111c1576a, retrieved 2026-10-11, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF