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CD74HCT173M96

Texas Instruments · Flip Flops · SOIC-16

CD74HCT173M96 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE1 input Active-low output enable 1; outputs go to high-impedance when either OE1 or OE2 is high, without affecting flip-flop operation.
2 OE2 input Active-low output enable 2; outputs go to high-impedance when either OE1 or OE2 is high, without affecting flip-flop operation.
3 Q0 tri_state Three-state buffered Q output of flip-flop 0, able to drive 15 LSTTL loads.
4 Q1 tri_state Three-state buffered Q output of flip-flop 1, able to drive 15 LSTTL loads.
5 Q2 tri_state Three-state buffered Q output of flip-flop 2, able to drive 15 LSTTL loads.
6 Q3 tri_state Three-state buffered Q output of flip-flop 3, able to drive 15 LSTTL loads.
7 CP input Shared clock input; Q outputs change on the positive-going (low-to-high) clock edge.
8 GND power_in Ground supply pin.
9 E1 input Data enable 1; when E1 or E2 is high, Q outputs are fed back and the flip-flops hold their state on the clock edge.
10 E2 input Data enable 2; when E1 or E2 is high, Q outputs are fed back and the flip-flops hold their state on the clock edge.
11 D3 input Data input to flip-flop 3, sampled on the rising clock edge.
12 D2 input Data input to flip-flop 2, sampled on the rising clock edge.
13 D1 input Data input to flip-flop 1, sampled on the rising clock edge.
14 D0 input Data input to flip-flop 0, sampled on the rising clock edge.
15 MR input Master reset input; taking MR to logic high resets the flip-flops (Q low).
16 VCC power_in Positive supply; 4.5 V to 5.5 V for HCT types, with a 0.1-µF bypass capacitor recommended close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Logic
Pins 16

CAD (KiCad official)

  • Symbol: CD74HCT173M96
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: cd74hct173m96-etched.step / cd74hct173m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hct173m96.step / cd74hct173m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 6ad3dbf1cefe1afb, retrieved 2026-10-06, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF