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Contents

README

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CD74HC365M96

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-16

CD74HC365M96 from Texas Instruments, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 OE1 input Active-low output enable 1; NORed with OE2, so when either enable is high all six outputs are forced to high impedance (Z).
2 1A input Data input of buffer 1; for HCT types VIL is 0.8 V max and VIH is 2 V min.
3 1Y tri_state Non-inverting three-state output of buffer 1 (HC/HCT365), high impedance when OE1 or OE2 is high.
4 2A input Data input of buffer 2; for HCT types VIL is 0.8 V max and VIH is 2 V min.
5 2Y tri_state Non-inverting three-state output of buffer 2 (HC/HCT365), high impedance when OE1 or OE2 is high.
6 3A input Data input of buffer 3; for HCT types VIL is 0.8 V max and VIH is 2 V min.
7 3Y tri_state Non-inverting three-state output of buffer 3 (HC/HCT365), high impedance when OE1 or OE2 is high.
8 GND power_in Ground reference pin.
9 4Y tri_state Non-inverting three-state output of buffer 4 (HC/HCT365), high impedance when OE1 or OE2 is high.
10 4A input Data input of buffer 4; for HCT types VIL is 0.8 V max and VIH is 2 V min.
11 5Y tri_state Non-inverting three-state output of buffer 5 (HC/HCT365), high impedance when OE1 or OE2 is high.
12 5A input Data input of buffer 5; for HCT types VIL is 0.8 V max and VIH is 2 V min.
13 6Y tri_state Non-inverting three-state output of buffer 6 (HC/HCT365), high impedance when OE1 or OE2 is high.
14 6A input Data input of buffer 6; for HCT types VIL is 0.8 V max and VIH is 2 V min.
15 OE2 input Active-low output enable 2; NORed with OE1, so when either enable is high all six outputs are forced to high impedance (Z).
16 VCC power_in Supply pin; HC types operate from 2 V to 6 V and HCT types from 4.5 V to 5.5 V, and each VCC terminal should have a 0.1 µF bypass capacitor placed as close as possible.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-16
Category Logic
Pins 16

CAD (KiCad official)

  • Symbol: CD74HC365M96
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: cd74hc365m96-etched.step / cd74hc365m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hc365m96.step / cd74hc365m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (20 pp, sha256 4bef810e35619ad7, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF