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Ray Initial commit: component/cd74hc125m96 c83d50c 2d ago

CD74HC125M96

Texas Instruments · Buffers, Drivers, Receivers, Transceivers · SOIC-14

CD74HC125M96 from Texas Instruments, in a SOIC-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1OE input Active-low output enable for buffer channel 1; when 1OE is high, output 1Y is placed in the high-impedance (Z) state.
2 1A input Data input of buffer channel 1; each gate performs Y = A in positive logic.
3 1Y tri_state Three-state output of channel 1, following A when 1OE is low and high-impedance when 1OE is high.
4 2OE input Active-low output enable for buffer channel 2; when 2OE is high, output 2Y is placed in the high-impedance (Z) state.
5 2A input Data input of buffer channel 2; each gate performs Y = A in positive logic.
6 2Y tri_state Three-state output of channel 2, following A when 2OE is low and high-impedance when 2OE is high.
7 GND power_in Ground reference for the device.
8 3Y tri_state Three-state output of channel 3, following A when 3OE is low and high-impedance when 3OE is high.
9 3A input Data input of buffer channel 3; each gate performs Y = A in positive logic.
10 3OE input Active-low output enable for buffer channel 3; when 3OE is high, output 3Y is placed in the high-impedance (Z) state.
11 4Y tri_state Three-state output of channel 4, following A when 4OE is low and high-impedance when 4OE is high.
12 4A input Data input of buffer channel 4; each gate performs Y = A in positive logic.
13 4OE input Active-low output enable for buffer channel 4; when 4OE is high, output 4Y is placed in the high-impedance (Z) state.
14 VCC power_in Positive supply; the recommended supply range is 2 V to 6 V, with a 0.1-µF bypass capacitor recommended close to the pin.

Key specifications

Parameter Value
Manufacturer Texas Instruments
Package SOIC-14
Category Logic
Pins 14

CAD (KiCad official)

  • Symbol: CD74HC125M96
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOIC-14 (KiCad packages3D, STEP)
  • 3D model files: cd74hc125m96-etched.step / cd74hc125m96-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd74hc125m96.step / cd74hc125m96.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Texas Instruments datasheet (26 pp, sha256 d24ee540bf543f7c, retrieved 2026-10-08, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF