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Contents

README

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CD4069UBM96-HXY

HXY MOSFET · Inverters · SOP-14

CD4069UBM96-HXY from HXY MOSFET, in a SOP-14. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 1A input Data input of inverter 1; unused inputs must be connected to VDD, VSS, or another input.
2 1Y output Data output of inverter 1.
3 2A input Data input of inverter 2; unused inputs must be connected to VDD, VSS, or another input.
4 2Y output Data output of inverter 2.
5 3A input Data input of inverter 3; unused inputs must be connected to VDD, VSS, or another input.
6 3Y output Data output of inverter 3.
7 VSS power_in Ground (0V) reference for the supply.
8 4Y output Data output of inverter 4.
9 4A input Data input of inverter 4; unused inputs must be connected to VDD, VSS, or another input.
10 5Y output Data output of inverter 5.
11 5A input Data input of inverter 5; unused inputs must be connected to VDD, VSS, or another input.
12 6Y output Data output of inverter 6.
13 6A input Data input of inverter 6; unused inputs must be connected to VDD, VSS, or another input.
14 VDD power_in Supply voltage, recommended range 3V to 15V referenced to VSS (absolute maximum -0.5V to +18V).

Key specifications

Parameter Value
Manufacturer HXY MOSFET
Package SOP-14
Category Logic
Pins 14

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDD -0.5 18 V 3
DC input current IIK -10 10 mA any one input 3
Storage temperature Tstg -65 150 ℃ 3
Total power dissipation Ptot 500 mW 3
Device dissipation P 100 mW per output transistor 3
Soldering temperature TL 260 ℃ 10s, SOP/TSSOP 3
Supply voltage VDD 3 15 V 3
Ambient temperature Tamb -40 125 ℃ in free air 3
Supply current IDD 1 uA Tamb=25°C, VIN=0,5V, VDD=5V 4
LOW-level output current IOL 0.41 mA Tamb=25°C, VO=0.4V, VIN=0,5V, VDD=5V 4
LOW-level output current IOL 0.55 mA Tamb=25°C, VO=0.5V, VIN=0,10V, VDD=10V 4
LOW-level output current IOL 1.7 mA Tamb=25°C, VO=1.5V, VIN=0,15V, VDD=15V 4
HIGH-level output current IOH -0.41 mA Tamb=25°C, VO=4.6V, VIN=0,5V, VDD=5V 4
HIGH-level output current IOH -1.6 mA Tamb=25°C, VO=2.5V, VIN=0,5V, VDD=5V 4
HIGH-level output current IOH -0.65 mA Tamb=25°C, VO=9.5V, VIN=0,10V, VDD=10V 4
HIGH-level output current IOH -2 mA Tamb=25°C, VO=13.5V, VIN=0,15V, VDD=15V 4
LOW-level output voltage VOL 0 0.05 V Tamb=25°C, VIN=0,5V, VDD=5V 4
HIGH-level output voltage VOH 4.95 5 V Tamb=25°C, VIN=0,5V, VDD=5V 4
HIGH-level output voltage VOH 9.95 10 V Tamb=25°C, VIN=0,10V, VDD=10V 4
HIGH-level output voltage VOH 14.95 15 V Tamb=25°C, VIN=0,15V, VDD=15V 4
LOW-level input voltage VIL 1 V Tamb=25°C, VO=0.5,4.5V, VDD=5V 4
LOW-level input voltage VIL 2 V Tamb=25°C, VO=1,9V, VDD=10V 4
LOW-level input voltage VIL 2.5 V Tamb=25°C, VO=1.5,13.5V, VDD=15V 4
HIGH-level input voltage VIH 4 V Tamb=25°C, VO=0.5V, VDD=5V 4
HIGH-level input voltage VIH 8 V Tamb=25°C, VO=1V, VDD=10V 4
HIGH-level input voltage VIH 12.5 V Tamb=25°C, VO=1.5V, VDD=15V 4
Input leakage current II -1 1 uA Tamb=25°C, VIN=0,15V, VDD=15V 4
Supply current IDD 30 uA Tamb=-40°C to +125°C, VIN=0,15V, VDD=15V 6
Supply current IDD 7.5 uA Tamb=-40°C to +125°C, VIN=0,5V, VDD=5V 6
LOW-level output current IOL 1.2 mA Tamb=+125°C, VO=1.5V, VIN=0,15V, VDD=15V 6
HIGH-level output current IOH -1.4 mA Tamb=+125°C, VO=13.5V, VIN=0,15V, VDD=15V 6
Input leakage current II -10 10 uA Tamb=-40°C to +125°C, VIN=0,15V, VDD=15V 6
Propagation delay time tPHL, tPLH 55 110 ns VDD=5V, see Figure 4 7
Propagation delay time tPHL, tPLH 30 60 ns VDD=10V, see Figure 4 7
Propagation delay time tPHL, tPLH 25 50 ns VDD=15V, see Figure 4 7
Transition time tTHL, tTLH 100 200 ns VDD=5V, see Figure 4 7
Transition time tTHL, tTLH 50 100 ns VDD=10V, see Figure 4 7
Transition time tTHL, tTLH 40 80 ns VDD=15V, see Figure 4 7
Input capacitance CI 10 15 pF any input 7

CAD (KiCad official)

  • Symbol: CD4069UBM96-HXY
  • Footprint: Package_SO:SOIC-14_3.9x8.7mm_P1.27mm
  • 3D model: SOP-14 (KiCad packages3D, STEP)
  • 3D model files: cd4069ubm96-hxy-etched.step / cd4069ubm96-hxy-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cd4069ubm96-hxy.step / cd4069ubm96-hxy.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: HXY MOSFET datasheet (10 pp, sha256 4e0e6c427747c58e, retrieved 2026-10-23, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF