component
CC2640R2FRHBT
Public Made by Adomby adom
Texas Instruments RF Transceiver ICs, VQFN-32-EP(5x5). Pinout reviewed by a person against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCC2640R2FRHBT
Texas Instruments · RF Transceiver ICs · VQFN-32-EP(5x5)
CC2640R2FRHBT from Texas Instruments, in a VQFN-32-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | RF_P | bidirectional | Positive RF port: input to the LNA during RX and output from the PA during TX. |
| 2 | RF_N | bidirectional | Negative RF port: input to the LNA during RX and output from the PA during TX. |
| 3 | RX_TX | bidirectional | Optional bias pin for the RF LNA. |
| 4 | X32K_Q1 | passive | 32-kHz crystal oscillator pin 1. |
| 5 | X32K_Q2 | passive | 32-kHz crystal oscillator pin 2. |
| 6 | DIO_0 | bidirectional | GPIO also usable by the Sensor Controller. |
| 7 | DIO_1 | bidirectional | GPIO also usable by the Sensor Controller. |
| 8 | DIO_2 | bidirectional | GPIO with Sensor Controller function and high-drive capability. |
| 9 | DIO_3 | bidirectional | GPIO with Sensor Controller function and high-drive capability. |
| 10 | DIO_4 | bidirectional | GPIO with Sensor Controller function and high-drive capability. |
| 11 | VDDS2 | power_in | 1.8-V to 3.8-V GPIO supply. |
| 12 | DCOUPL | power_out | 1.27-V regulated digital-supply decoupling pin; do not supply external circuitry from this pin. |
| 13 | JTAG_TMSC | bidirectional | JTAG TMSC digital I/O with high-drive capability. |
| 14 | JTAG_TCKC | bidirectional | JTAG TCKC digital I/O; noise-immunity design considerations are given in the JTAG Interface chapter of the TRM. |
| 15 | DIO_5 | bidirectional | GPIO with high-drive capability, also usable as JTAG_TDO. |
| 16 | DIO_6 | bidirectional | GPIO with high-drive capability, also usable as JTAG_TDI. |
| 17 | DCDC_SW | power_out | Output from the internal DC/DC converter. |
| 18 | VDDS_DCDC | power_in | 1.8-V to 3.8-V supply for the DC/DC converter. |
| 19 | RESET_N | input | Active-low reset input with no internal pullup. |
| 20 | DIO_7 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 21 | DIO_8 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 22 | DIO_9 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 23 | DIO_10 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 24 | DIO_11 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 25 | DIO_12 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 26 | DIO_13 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 27 | DIO_14 | bidirectional | Digital/analog GPIO with Sensor Controller and analog capability. |
| 28 | VDDS | power_in | 1.8-V to 3.8-V main chip supply. |
| 29 | VDDR | power_in | 1.7-V to 1.95-V supply, typically connected to the output of the internal DC/DC; do not supply external circuitry from this pin. |
| 30 | X24M_N | passive | 24-MHz crystal oscillator pin 1. |
| 31 | X24M_P | passive | 24-MHz crystal oscillator pin 2. |
| 32 | VDDR_RF | power_in | 1.7-V to 1.95-V supply, typically connected to the output of the internal DC/DC; must be connected to VDDR if the internal DC/DC is not used. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Texas Instruments |
| Package | VQFN-32-EP(5x5) |
| Category | RF And Wireless |
| Pins | 33 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Supply voltage (VDDS, VDDS2, VDDS3), DC/DC or GLDO | -0.3 | 4.1 | V | VDDR supplied by internal DC/DC regulator or internal GLDO. VDDS_DCDC connected to VDDS on PCB | 16 | ||
| Supply voltage (VDDS and VDDR), external regulator mode | -0.3 | 2.25 | V | External regulator mode (VDDS and VDDR pins connected on PCB) | 16 | ||
| Voltage on any digital pin | -0.3 | 4.1 | V | VDDSx + 0.3, max 4.1 V | 16 | ||
| Voltage on crystal oscillator pins | -0.3 | 2.25 | V | X32K_Q1, X32K_Q2, X24M_N, X24M_P; VDDR + 0.3, max 2.25 V | 16 | ||
| Voltage on ADC input, scaling disabled, internal reference | Vin | -0.3 | 1.49 | V | Voltage scaling disabled, internal reference | 16 | |
| Input RF level | 5 | dBm | 16 | ||||
| Storage temperature | Tstg | -40 | 150 | °C | 16 | ||
| ESD HBM, all pins | VESD | -2500 | 2500 | V | RSM, RHB, RGZ packages, HBM per ANSI/ESDA/JEDEC JS001 | 16 | |
| ESD CDM, RF pins | VESD | -500 | 500 | V | CDM per JESD22-C101 | 16 | |
| ESD CDM, non-RF pins | VESD | -500 | 500 | V | CDM per JESD22-C101 | 16 | |
| Ambient temperature | -40 | 85 | °C | 17 | |||
| Operating supply voltage VDDS and VDDR, external regulator mode | 1.7 | 1.95 | V | VDDS and VDDR pins connected on PCB, internal DC/DC cannot be used | 17 | ||
| Operating supply voltage VDDS | VDDS | 1.8 | 3.8 | V | Battery-powered and 3.3-V systems | 17 | |
| Operating supply voltages VDDS2 and VDDS3 | 1.8 | 3.8 | V | VDDS < 2.7 V | 17 | ||
| Operating supply voltages VDDS2 and VDDS3 | 1.9 | 3.8 | V | VDDS ≥ 2.7 V | 17 | ||
| Junction-to-ambient thermal resistance (RHB) | RθJA | 32.8 | °C/W | RHB package | 30 | ||
| Junction-to-case (top) thermal resistance (RHB) | RθJC(top) | 24 | °C/W | RHB package | 30 | ||
| Junction-to-board thermal resistance (RHB) | RθJB | 6.8 | °C/W | RHB package | 30 | ||
| Junction-to-top characterization parameter (RHB) | PsiJT | 0.3 | °C/W | RHB package | 30 | ||
| Junction-to-board characterization parameter (RHB) | PsiJB | 6.8 | °C/W | RHB package | 30 | ||
| Junction-to-case (bottom) thermal resistance (RHB) | RθJC(bot) | 1.9 | °C/W | RHB package | 30 | ||
| GPIO VOH at 8-mA load | VOH | 1.32 | 1.54 | V | TA = 25°C, VDDS = 1.8 V, IOCURR = 2, high-drive GPIOs only | 28 | |
| GPIO VOL at 8-mA load | VOL | 0.26 | 0.32 | V | TA = 25°C, VDDS = 1.8 V, IOCURR = 2, high-drive GPIOs only | 28 | |
| GPIO VOH at 4-mA load | VOH | 1.32 | 1.58 | V | TA = 25°C, VDDS = 1.8 V, IOCURR = 1 | 28 | |
| GPIO VOL at 4-mA load | VOL | 0.21 | 0.32 | V | TA = 25°C, VDDS = 1.8 V, IOCURR = 1 | 28 | |
| VIH | VIH | 0.8 | V | TA = 25°C; lowest GPIO input voltage reliably interpreted as High; value in multiples of VDDS | 30 | ||
| VIL | VIL | 0.2 | V | TA = 25°C; highest GPIO input voltage reliably interpreted as Low; value in multiples of VDDS | 30 | ||
| Rising supply-voltage slew rate | 0 | 100 | mV/µs | 30 | |||
| Falling supply-voltage slew rate | 0 | 20 | mV/µs | 30 | |||
| Falling supply-voltage slew rate, low-power flash settings | 3 | mV/µs | 30 | ||||
| Positive temperature gradient in standby | 5 | °C/s | No limitation for negative temperature gradient, or outside standby mode | 30 | |||
| RESET_N low duration | 1 | µs | TA = -40°C to +85°C, VDDS = 1.7 V to 3.8 V | 30 | |||
| 24-MHz crystal ESR | ESR | 60 | Ω | 6 pF < CL ≤ 9 pF | 23 | ||
| 24-MHz crystal frequency tolerance | -40 | 40 | ppm | 23 | |||
| 32.768-kHz crystal frequency tolerance | -500 | 500 | ppm | Bluetooth low-energy applications | 23 | ||
| Uncalibrated RCOSC_HF accuracy | -1 | 1 | % | 24 | |||
| Calibrated RCOSC_HF accuracy | -0.25 | 0.25 | % | 24 | |||
| RCOSC_LF temperature coefficient | 80 | ppm/°C | 24 | ||||
| ADC INL | INL | -3 | 3 | LSB | 24 | ||
| Temperature sensor accuracy | -5 | 5 | °C | 25 | |||
| Core current, Standby (RCOSC_LF) | Icore | 1.1 | µA | Standby. With RTC, CPU, RAM and (partial) register retention. RCOSC_LF | 17 | ||
| Radio RX current | 5.9 | mA | Radio RX (1) | 17 |
CAD (KiCad official)
- Symbol:
CC2640R2FRHBT - Footprint:
Package_DFN_QFN:QFN-32-1EP_5x5mm_P0.5mm_EP3.3x3.3mm - 3D model: VQFN-32-EP(5x5) (KiCad packages3D, STEP)
- 3D model files:
cc2640r2frhbt-etched.step/cc2640r2frhbt-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cc2640r2frhbt.step/cc2640r2frhbt.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Texas Instruments datasheet (74 pp, sha256
f98887f9fc5928da, retrieved 2026-10-22, tier: lcsc) - Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- Extractor:
ds2sf(Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate. - CAD: KiCad official libraries (CC-BY-SA 4.0).