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CBM811RST4

Corebai Microelectronics · Monitors & Reset Circuits · SOT-143-4

CBM811RST4 from Corebai Microelectronics, in a SOT-143-4. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Power supply ground, 0 V.
2 RESET output Active-low logic reset output for the CBM811 variant, which remains asserted low down to VCC of 1 V during power-down.
3 MR input Debounced manual reset input; input signals shorter than 100 ns are ignored and inputs longer than 10 µs reliably trigger reset.
4 VCC power_in Monitored supply voltage input for 2.5 V, 3 V, 3.3 V or 5 V systems, with an absolute maximum rating of −0.3 V to +6 V.

Key specifications

Parameter Value
Manufacturer Corebai Microelectronics
Package SOT-143-4
Category Power Management
Pins 4

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VCC 1 5.5 V 5
Supply current ICC 8 15 μA 5
Reset threshold CBM811R/CBM812R (min row) VTH 2.58 2.63 2.68 V TA = −40°C to +85°C 5
Reset threshold CBM811R/CBM812R (wide tolerance row) VTH 2.55 2.7 V TA = −40°C to +85°C 5
Manual reset minimum pulse width 10 μs 5
Fault immunity (manual reset input noise rejection) 100 ns 5
Transfer delay to reset 0.5 μs 5
Manual reset pull-up resistor 10 20 30 kΩ 5
Power-up reset timeout 140 ms 1
Reset output hold time after VCC above threshold 240 ms 8
VCC terminal voltage (relative to GND) VCC -0.3 6 V relative to GND 4
Input voltage range VIN -0.3 V relative to GND; upper limit VCC + 0.3 V 4
VCC input current ICC 20 mA 4
MR input current IMR 20 mA 4
RESET output current IRESET 20 mA 4
Power dissipation (SOT-143) PD 200 mW TA = 70°C 4
Power dissipation derating 4 mW/°C above 70°C 4
Thermal resistance junction to ambient θJA 330 °C/W 4
Operating temperature range TA -40 85 °C 4
Storage temperature range TSTG -65 160 °C 4
Lead temperature (soldering, 10 s) 300 °C soldering, 10 s 4
Vapor phase temperature 215 °C 60 s 4
Infrared temperature 220 °C 15 s 4
ESD rating 3 kV 4

CAD (KiCad official)

  • Symbol: CBM811RST4
  • Footprint: Package_TO_SOT_SMD:SOT-143
  • 3D model: SOT-143-4 (KiCad packages3D, STEP)
  • 3D model files: cbm811rst4-etched.step / cbm811rst4-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cbm811rst4.step / cbm811rst4.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Corebai Microelectronics datasheet (10 pp, sha256 bbff3e5248124a6f, retrieved 2026-10-27, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF