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CBM810TST3

Corebai Microelectronics · Monitors & Reset Circuits · SOT-23-3

CBM810TST3 from Corebai Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 GND power_in Ground reference pin; all signals are referenced to ground (0 V).
2 RESET output Active-high push-pull reset output that stays asserted while VCC is below the reset threshold and for 240 ms typical after VCC rises above it.
3 VCC power_in Supply voltage being monitored, specified from 1.0 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Corebai Microelectronics
Package SOT-23-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC 1 5.5 V 4
Supply current 17 30 µA VCC < 3.6V, CBM8XXR/S/T/Z 4
Reset threshold (VRST) VRST 3.04 3.08 3.11 V CBM803T/CBM809T/CBM810T 4
Reset pulse width 140 240 460 ms 4
RESET output low voltage (CBM810X) VOL 0.3 V VCC = VTH min, ISINK = 1.2 mA, CBM810R/S/T/Z 4
RESET output high voltage (CBM810X) VOH 0.8 x VCC 1.8 V < VCC < VTH min, ISOURCE = 150 µA 5
Supply voltage VCC absolute maximum VCC -0.3 6 V TA = 25°C unless otherwise noted 5
RESET (push-pull) voltage -0.3 V Push-pull output; maximum printed as VCC+0.5V 5
Input current (VCC) 20 mA 5
Output current (RESET, RESET) 20 mA 5
VCC rise rate 100 V/µs 5
Lead temperature (soldering, 10 s) 300 °C 10 s 5
Vapor phase soldering (60 s) 215 °C 60 s 5
Infrared soldering (15 s) 220 °C 15 s 5
Storage temperature range -65 150 °C 5
Thermal resistance junction-to-ambient (SOT-23) θJA 270 °C/W SOT-23 package 5
Operating ambient temperature -40 85 °C Temperature range for CBM810TST3 from ordering table 13

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: CBM810TST3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: cbm810tst3-etched.step / cbm810tst3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cbm810tst3.step / cbm810tst3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Corebai Microelectronics datasheet (13 pp, sha256 185a6d7df019adba, retrieved 2026-11-12, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF