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CBM810MST3

Corebai Microelectronics · Monitors & Reset Circuits · SOT-23-3

CBM810MST3 from Corebai Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 GND power_in Ground; all signals are referenced to ground (0 V).
2 RESET output Logic-high reset output that is asserted while VCC is below the reset threshold and stays high for 240 ms typical after VCC rises above the threshold.
3 VCC power_in Monitored supply voltage input; reset output remains operable down to VCC of 1 V.

Key specifications

Parameter Value
Manufacturer Corebai Microelectronics
Package SOT-23-3
Category Power Management ICs
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range 1 5.5 V 4
Reset threshold (CBM810M) VRST 4.31 4.38 4.45 V CBM803M/CBM809M/CBM810M 4
Reset pulse width 140 240 460 ms 4
Supply current 24 35 μA VCC < 5.5V, CBM8XXL/M/J 4
RESET output low voltage (CBM810X) VOL 0.4 V VCC = VTH min, ISINK = 3.2 mA, CBM810L/M/J 5
Supply voltage (absolute maximum) VCC -0.3 6 V TA = 25°C unless otherwise noted 5
RESET output voltage, push-pull (absolute maximum) RESET -0.3 V Push-pull output; upper limit printed as VCC+0.5V 5
Input current (VCC) 20 mA 5
Output current (RESET, RESET) 20 mA RESET, RESET 5
VCC rise rate 100 V/μs 5
Storage temperature range -65 150 °C 5
Lead temperature (soldering) 300 °C 10 sec 5
Vapor phase soldering 215 °C 60 sec 5
Infrared soldering 220 °C 15 sec 5
Operating temperature range -40 85 °C Temperature range per ordering table for CBM810MST3 (SOT23-3) 12
Thermal resistance, junction-to-ambient (SOT-23) θJA 270 °C/W SOT-23 5

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: CBM810MST3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.92 mm, terminals on the pads, 1.0050000000000001 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: cbm810mst3-etched.step / cbm810mst3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cbm810mst3.step / cbm810mst3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Corebai Microelectronics datasheet (13 pp, sha256 185a6d7df019adba, retrieved 2026-11-12, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF