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Contents

README

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CBM809LST3

Corebai Microelectronics · Supervisor And Reset ICs · SOT-23-3

CBM809LST3 from Corebai Microelectronics, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 GND power_in Ground pin; all signals are referenced to ground (0 V).
2 RESET output Active-low push-pull reset output (CBM809X): it is held low while VCC is below the reset threshold and stays low for 240 ms typical after VCC rises above the threshold.
3 VCC power_in Monitored supply voltage input; the reset threshold is 4.63 V for CBM809L, and the supply operates from 1.0 V to 5.5 V.

Key specifications

Parameter Value
Manufacturer Corebai Microelectronics
Package SOT-23-3
Category Power Management (PMIC)
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage range VCC 1 5.5 V 4
Supply current 24 35 μA VCC < 5.5V, CBM8XXL/M/J 4
Reset threshold (CBM803L/CBM809L/CBM810L) VRST 4.56 4.63 4.7 V CBM803L/CBM809L/CBM810L 4
Reset pulse width 140 240 460 ms 4
RESET output low voltage (push-pull, CBM809L/M/J) VOL 0.4 V VCC = VTH min, ISINK = 3.2 mA, CBM809L/M/J 4
RESET output low voltage (CBM809X) VOL 0.3 V VCC > 1.0 V, ISINK = 50 μA 4
VCC absolute maximum VCC -0.3 6 V TA = 25°C 5
RESET (push-pull) absolute maximum RESET -0.3 V Upper limit printed as VCC+0.5V 5
Input current (VCC) 20 mA TA = 25°C 5
Output current (RESET, RESET) 20 mA TA = 25°C 5
Rise rate, VCC 100 V/μs TA = 25°C 5
Thermal resistance junction-to-ambient θJA (SOT-23) θJA 270 °C/W SOT-23 package 5
Pin temperature (soldering, 10 sec) 300 ℃ 10 sec 5
Vapor phase soldering (60 s) 215 ℃ 60 s 5
Infrared soldering (15 s) 220 ℃ 15 s 5
Storage temperature range TSTG -65 150 ℃ 5
Operating temperature range TA -40 85 ℃ CBM809LST3 ordering information 12

CAD (KiCad official)

  • Symbol: CBM809LST3
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: cbm809lst3-etched.step / cbm809lst3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); cbm809lst3.step / cbm809lst3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Corebai Microelectronics datasheet (13 pp, sha256 bb29cdcddffe3165, retrieved 2026-10-18, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF