# CBM201209U000T

**FH Guangdong Fenghua Advanced Tech** · Ferrite Beads · 0805

CBM201209U000T from FH Guangdong Fenghua Advanced Tech, in a 0805. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | 1 | passive | Terminal 1 of an unpolarised inductor or ferrite bead; either orientation. |
| 2 | 2 | passive | Terminal 2 of an unpolarised inductor or ferrite bead; either orientation. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | FH Guangdong Fenghua Advanced Tech |
| Package | 0805 |
| Category | Filters |
| Pins | 2 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| DC resistance (DCR) | RDC |  |  | 0.01 | Ω | RDC test: RM3542A or equivalent, 15℃~35℃, 25%~75% RH | 4 |
| Rated current | Ir |  |  | 6000 | mA | Max rated current for this part; surface temperature rise not to exceed 40℃ when rated current applied | 4 |
| Surface temperature rise at rated current |  |  |  | 40 | ℃ | Rated current applied | 2 |
| Impedance accuracy range at 100 MHz (nominal 0 Ω) | /Z/ | 0 | 0 | 15 | Ω | Test frequency 100 MHz; E4982A or equivalent, test voltage 50mV±5mV, 15℃~35℃, 25%~75% RH | 4 |
| Impedance change after resistance to soldering heat |  | -30 |  | 30 | % | Solder temperature 260℃±5℃, immersion 10±1 s | 9 |
| Impedance change after low temperature resistance |  | -30 |  | 30 | % | Test temperature -55±2℃, testing time 1000-0/+24 h | 9 |
| Operating temperature range | T_op | -55 |  | 125 | ℃ | Includes product surface temperature rise; derating required above +85℃ for rated current ≥1 A | 8 |

## CAD (KiCad official)

- Symbol: `CBM201209U000T`
- Footprint: `Inductor_SMD:L_0805_2012Metric`
- 3D model: 0805 (KiCad packages3D, STEP)
- 3D model files: `cbm201209u000t-etched.step` / `cbm201209u000t-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cbm201209u000t.step` / `cbm201209u000t.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [FH Guangdong Fenghua Advanced Tech datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8757889540478509056) (30 pp, sha256 `3d8301c995e8a19f`, retrieved 2026-10-17, tier: lcsc)
- **Datasheet language:** Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
- **Extractor:** parts-factory `2.0.0` / `extract_pins`, primary `two-terminal convention` (convention), consensus `off` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cbm201209u000t-datasheet.pdf)