component
CAT93C46BVI-GT3
Public Made by Adomby adom
onsemi EEPROM, SOIC-8. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
3D Model
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Symbol & Footprint
Schematic Symbol
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PCB Footprint
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Datasheet
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README
markdownCAT93C46BVI-GT3
onsemi · EEPROM · SOIC-8
CAT93C46BVI-GT3 from onsemi, in a SOIC-8. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | CS | input | Chip Select input; the device must be deselected for a minimum of tCSMIN after a WRITE, ERASE, ERAL or WRAL instruction so the self-timed cycle can start on the falling edge of CS. |
| 2 | SK | input | Serial clock input; instructions, addresses and write data are clocked into DI on its rising edge, with maximum clock frequency of 2000 kHz for VCC < 3.3 V and 4000 kHz for VCC > 3.3 V. |
| 3 | DI | input | Serial data input that receives the start bit, opcode, address and write data on the rising edge of SK, with DI setup and hold times of 100 ns for VCC < 3.3 V and 50 ns for VCC > 3.3 V. |
| 4 | DO | output | Serial data output that is in a high-impedance state except while reading data or polling the ready/busy status during a write cycle, and returns to high-impedance on the rising edge of SK. |
| 5 | GND | power_in | Ground reference for the device; input voltages must not be lower than −0.5 V with respect to ground under normal operation. |
| 6 | ORG | input | Memory organization select: connect to VCC for x16 (64 × 16-bit registers), to GND for x8 (128 × 8-bit registers), and if left unconnected an internal pullup selects x16. |
| 7 | NC | unconnected | No internal connection on this package pin. |
| 8 | VCC | power_in | Power supply input; the device operates from 1.8 V (1.65 V for the CAT93C46Bxx-xxL option at TA = −20 °C to +85 °C) to 5.5 V. |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | onsemi |
| Package | SOIC-8 |
| Category | Memory |
| Pins | 8 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Storage Temperature | -65 | 150 | °C | 2 | |||
| Voltage on Any Pin with Respect to Ground | -0.5 | 6.5 | V | Note 1 | 2 | ||
| Endurance | NEND | 1e+06 | Program / Erase Cycles | Block Mode, VCC = 5 V, 25°C (Note 3) | 2 | ||
| Data Retention | TDR | 100 | Years | 2 | |||
| Supply Current (Write) | ICC1 | 1 | mA | Write, VCC = 5.0 V | 2 | ||
| Supply Current (Read) | ICC2 | 500 | µA | Read, DO open, fSK = 2 MHz, VCC = 5.0 V | 2 | ||
| Standby Current (x8 Mode) | ISB1 | 2 | µA | VIN = GND or VCC, CS = GND, ORG = GND, TA = −40°C to +85°C | 2 | ||
| Standby Current (x16 Mode) | ISB2 | 1 | µA | VIN = GND or VCC, CS = GND, ORG = Float or VCC, TA = −40°C to +85°C | 2 | ||
| Input Leakage Current | ILI | 1 | µA | VIN = GND to VCC, TA = −40°C to +85°C | 2 | ||
| Output Leakage Current | ILO | 1 | µA | VOUT = GND to VCC, CS = GND, TA = −40°C to +85°C | 2 | ||
| Input Low Voltage | VIL1 | -0.1 | 0.8 | V | 4.5 V ≤ VCC < 5.5 V | 2 | |
| Input High Voltage | VIH1 | 2 | V | 4.5 V ≤ VCC < 5.5 V | 2 | ||
| Input Low Voltage | VIL2 | 0 | V | 1.65 V ≤ VCC < 4.5 V | 2 | ||
| Output Low Voltage | VOL1 | 0.4 | V | 4.5 V ≤ VCC < 5.5 V, IOL = 3 mA | 2 | ||
| Output High Voltage | VOH1 | 2.4 | V | 4.5 V ≤ VCC < 5.5 V, IOH = −400 µA | 2 | ||
| Output Low Voltage | VOL2 | 0.2 | V | 1.65 V ≤ VCC < 4.5 V, IOL = 1 mA | 2 | ||
| Output Capacitance (DO) | COUT | 5 | pF | VOUT = 0 V; TA = 25°C, f = 1 MHz, VCC = 5 V | 2 | ||
| Input Capacitance (CS, SK, DI, ORG) | CIN | 5 | pF | VIN = 0 V; TA = 25°C, f = 1 MHz, VCC = 5 V | 2 | ||
| CS Setup Time | tCSS | 50 | ns | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| CS Hold Time | tCSH | 0 | ns | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| DI Setup Time | tDIS | 100 | ns | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| DI Setup Time | tDIS | 50 | ns | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| DI Hold Time | tDIH | 100 | ns | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| DI Hold Time | tDIH | 50 | ns | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to 1 | tPD1 | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to 1 | tPD1 | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to 0 | tPD0 | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to 0 | tPD0 | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to High-Z | tHZ | 100 | ns | VCC < 3.3 V, TA = −40°C to +85°C (Note 5) | 3 | ||
| Program / Erase Cycle Time WRITE, ERASE | tEW | 3 | ms | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Program / Erase Cycle Time WRAL, ERAL | tEW | 5 | ms | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum CS Low Time | tCSMIN | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum CS Low Time | tCSMIN | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum SK High Time | tSKHI | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum SK High Time | tSKHI | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum SK Low Time | tSKLOW | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Minimum SK Low Time | tSKLOW | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to Status Valid | tSV | 0.25 | µs | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Output Delay to Status Valid | tSV | 0.1 | µs | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Maximum Clock Frequency | SKMAX | 2000 | kHz | VCC < 3.3 V, TA = −40°C to +85°C | 3 | ||
| Maximum Clock Frequency | SKMAX | 4000 | kHz | VCC > 3.3 V, TA = −40°C to +85°C | 3 | ||
| Power-up to Read Operation | tPUR | 0.1 | ms | 3 | |||
| Power-up to Write Operation | tPUW | 0.1 | ms | 3 | |||
| Supply Voltage | VCC | 1.8 | 5.5 | V | TA = −40°C to +85°C (industrial, no L suffix) | 2 | |
| Operating Temperature (Industrial) | TA | -40 | 85 | °C | I = Industrial grade, CAT93C46BVI-GT3 | 8 |
CAD (KiCad official)
- Symbol:
CAT93C46BVI-GT3 - Footprint:
Package_SO:SOIC-8_3.9x4.9mm_P1.27mm - 3D model: SOIC-8 (KiCad packages3D, STEP)
- 3D model files:
cat93c46bvi-gt3-etched.step/cat93c46bvi-gt3-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);cat93c46bvi-gt3.step/cat93c46bvi-gt3.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: onsemi datasheet (15 pp, sha256
9b07686c8bf02552, retrieved 2026-10-20, tier: lcsc) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-haiku-5-5(text), consensusclaude-sonnet-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: KiCad official libraries (CC-BY-SA 4.0).