# CAP200DG-TL

**POWER INTEGRATIONS** · Power Management - Specialized · SO-8

CAP200DG-TL from POWER INTEGRATIONS, in a SO-8. Pinout and pin descriptions extracted from the manufacturer datasheet by ds2sf; symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | NC | unconnected | No electrical connection. Pins 1-4 are recommended to be coupled together on the PCB to provide creepage/clearance of >4 mm across the SO-8 package. |
| 2 | D1 | passive | DRAIN 1 terminal. One of the two high-voltage MOSFET drain terminals used to conduct discharge current through the external series resistor R1 to the X capacitor. Rated 1000 V breakdown between D1 and D2 in either polarity, 5.333 mA peak current. |
| 3 | D1 | passive | DRAIN 1 terminal (duplicate of pin 2). Provides the high-voltage MOSFET drain connection to the R1/X-capacitor side of the circuit. |
| 4 | NC | unconnected | No electrical connection. Coupled with pins 1-3 on the PCB to increase creepage/clearance distance. |
| 5 | NC | unconnected | No electrical connection. Coupled with pins 6-8 on the PCB to increase creepage/clearance distance. |
| 6 | D2 | passive | DRAIN 2 terminal. One of the two high-voltage MOSFET drain terminals used to conduct discharge current through the external series resistor R2 to the other side of the X capacitor. Rated 1000 V breakdown between D1 and D2. |
| 7 | D2 | passive | DRAIN 2 terminal (duplicate of pin 6). Provides the high-voltage MOSFET drain connection to the R2/X-capacitor side of the circuit. |
| 8 | NC | unconnected | No electrical connection. Coupled with pins 5-7 on the PCB to increase creepage/clearance distance. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | POWER INTEGRATIONS |
| Package | SO-8 |
| Category | Power Management (PMIC) |
| Pins | 8 |

## Ordering variants

Same part, different packaging or reel option.

- `CAP200DG-TLD`

## CAD (KiCad official)

- Symbol: `CAP200DG-TL`
- Footprint: `Package_SO:TI_SO-PowerPAD-8`
- 3D model: SO-8 (KiCad packages3D, STEP)
- 3D model files: `cap200dg-tl-etched.step` / `cap200dg-tl-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `cap200dg-tl.step` / `cap200dg-tl.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [POWER INTEGRATIONS datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8588931400568987648) (8 pp, sha256 `77689303ada4d780`, retrieved 2026-08-17, tier: lcsc)
- **Extractor:** `ds2sf` (Claude). Every pin and dimension is cited to a datasheet page; it refuses to fabricate.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/cap200dg-tl-datasheet.pdf)