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Contents

README

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CA-IS3740HN

Chipanalog · Digital Isolators · SOIC-16

CA-IS3740HN from Chipanalog, in a SOIC-16. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDA power_in Side A supply voltage, recommended 2.375 V to 5.5 V, with a 0.1 µF to 1 µF bypass capacitor to GNDA.
2 GNDA power_in Side A ground reference.
3 VI1 input Side A logic input, channel 1.
4 VI2 input Side A logic input, channel 2.
5 VI3 input Side A logic input, channel 3 (CA-IS3740).
6 VI4 input Side A logic input, channel 4 (CA-IS3740).
7 NC unconnected No internal connection on CA-IS3740; may be left floating or connected to VDD or GND.
8 GNDA power_in Side A ground reference.
9 GNDB power_in Side B ground reference.
10 ENB input Side B output enable, active high or floating, internally pulled up to VDDB; low puts outputs VO1 to VO4 in high impedance.
11 VO4 output Side B logic output, channel 4 (CA-IS3740), high-Z when ENB is low.
12 VO3 output Side B logic output, channel 3 (CA-IS3740), high-Z when ENB is low.
13 VO2 output Side B logic output, channel 2, high-Z when ENB is low.
14 VO1 output Side B logic output, channel 1, high-Z when ENB is low.
15 GNDB power_in Side B ground reference.
16 VDDB power_in Side B supply voltage, recommended 2.375 V to 5.5 V, with a 0.1 µF to 1 µF bypass capacitor to GNDB.

Key specifications

Parameter Value
Manufacturer Chipanalog
Package SOIC-16
Category Interface ICs
Pins 16

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply voltage VDDA, VDDB (absolute max) VDDA, VDDB -0.5 7 V 5
Input voltage Ax, Bx, ENx (absolute max) Vin -0.5 V VDD+0.5, max voltage not to exceed 7 V 5
Output current (absolute max) IO -20 20 mA 5
Junction temperature (absolute max) TJ 150 °C 5
Storage temperature range TSTG -65 150 °C 5
ESD HBM VESD -6000 6000 V HBM per ANSI/ESDA/JEDEC JS-001, all pins 5
ESD CDM VESD -2000 2000 V CDM per JESD22-C101, all pins 5
Supply voltage VDDA, VDDB VDDA, VDDB 2.375 5.5 V typ 3.3/5.0 5
UVLO rising threshold VDD(UVLO+) 1.95 2.24 2.37 V VDD rising 5
UVLO falling threshold VDD(UVLO-) 1.88 2.1 2.325 V VDD falling 5
UVLO hysteresis VHYS(UVLO) 70 140 250 mV 5
High-level output current IOH -4 mA VDDO = 5V (-2 at 3.3V, -1 at 2.5V) 5
Low-level output current IOL 4 mA VDDO = 5V (2 at 3.3V, 1 at 2.5V) 5
Input threshold logic high VIH 2 V 5
Input threshold logic low VIL 0.8 V 5
Signaling rate DR 0 150 Mbps 5
Ambient temperature TA -40 27 125 °C 5
Junction-to-ambient thermal resistance SOIC16-NB RθJA 96.2 °C/W SOIC16-NB (N) 6
Maximum power dissipation CA-IS3740 PD 334 mW VDDA = VDDB = 5.5 V, CL = 15 pF, TJ = 150°C, 75MHz 50% duty square wave 6
Max power dissipation side A PDA 36 mW 6
Max power dissipation side B PDB 298 mW 6
High-level output voltage VOH 4.8 V VDD=5V±10%, IOH = -4mA; min is VDDO-0.4 9
Low-level output voltage VOL 0.2 0.4 V VDD=5V±10%, IOL = 4mA 9
Input threshold logic high VIT+(IN) 2 V VDD=5V±10% 9
Input threshold logic low VIT-(IN) 0.8 V VDD=5V±10% 9
Input high leakage current IIH 20 µA VIH = VDDA at Ax or Bx or ENx 9
Input low leakage current IIL -20 µA VIL = 0 V at Ax or Bx or ENx 9
Output impedance ZO 50 Ω 9
Common-mode transient immunity CMTI 100 150 kV/µs VI = VDDI or 0 V, VCM = 1200 V 9
Input capacitance CI 2 pF VI = VDD/2 + 0.4×sin(2πft), f = 1 MHz, VDD = 5 V 9
Supply current IDDA, DC, input high (H) IDDA 1.3 2.1 mA VDD=5V, ENB = VDDB; VIN = VDDA (CA-IS3740H) 10
Supply current IDDB, DC, input high (H) IDDB 2.7 3.9 mA VDD=5V, ENB = VDDB; VIN = VDDA (CA-IS3740H) 10
Supply current IDDA, DC, input low (H) IDDA 6.4 9.5 mA VDD=5V, ENB = VDDB; VIN = 0V (CA-IS3740H) 10
Supply current IDDB, DC, input low (H) IDDB 2.7 4 mA VDD=5V, ENB = VDDB; VIN = 0V (CA-IS3740H) 10
Supply current IDDA, 100Mbps IDDA 4.7 6.8 mA VDD=5V, ENB = VDDB; 50 MHz square wave, CL = 15 pF 10
Supply current IDDB, 100Mbps IDDB 41 54.7 mA VDD=5V, ENB = VDDB; 50 MHz square wave, CL = 15 pF 10
Data rate DR 150 Mbps 13
Minimum pulse width PWmin 5 ns 13
Propagation delay tPLH, tPHL 5 12 16 ns Figure 8-1 13
Pulse width distortion PWD 0.2 4.5 ns /tPLH - tPHL/ 13
Channel-to-channel skew tsk(o) 0.4 2.5 ns same-direction channels 13
Part-to-part skew tsk(pp) 2 4.5 ns 13
Output rise time tr 2.5 4 ns Figure 8-1 13
Output fall time tf 2.5 4 ns Figure 8-1 13
Disable delay, high to Hi-Z tPHZ 8 13 ns Figure 8-2 13
Disable delay, low to Hi-Z tPLZ 8 17 ns Figure 8-2 13
Enable delay, Hi-Z to high tPZH 15 30 ns CA-IS374xH, Figure 8-2 13
Enable delay, Hi-Z to low tPZL 15 30 ns CA-IS374xH, Figure 8-2 13
Default output delay time tDO 8 12 µs from UVLO, Figure 8-3 13
Start-up time tSU 15 40 µs 13
Maximum isolation voltage (UL 1577) VISO 3750 VRMS SOIC16-NB, VTEST = VISO, t = 60 s 7

CAD (KiCad official)

  • Symbol: CA-IS3740HN
  • Footprint: Package_SO:SOIC-16_3.9x9.9mm_P1.27mm
  • 3D model: SOIC-16 (KiCad packages3D, STEP)
  • 3D model files: ca-is3740hn-etched.step / ca-is3740hn-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ca-is3740hn.step / ca-is3740hn.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Chipanalog datasheet (25 pp, sha256 fd7bb5373a55db4c, retrieved 2026-10-22, tier: lcsc)
  • Datasheet language: Chinese. Pin names, descriptions, and specs on this page were extracted and translated to English by ds2sf; the linked PDF is the manufacturer original.
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF