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Contents

README

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CA-IS3721HG

Chipanalog · Digital Isolators · SOIC-8-300mil

CA-IS3721HG from Chipanalog, in a SOIC-8-300mil. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 VDDA power_in Side A power supply, operating range 2.375 V to 5.5 V relative to GNDA, with a 0.1 µF to 1 µF bypass capacitor.
2 VI1 input Side A digital input for channel 1, which is transmitted to VO1 on side B (CA-IS3721).
3 VO2 output Side A digital output for channel 2, which follows VI2 from side B (CA-IS3721); output drive is 4 mA at 5 V and defaults high on the H version when input power or signal is lost.
4 GNDA power_in Side A ground, the ground reference for VDDA and the side A signals.
5 GNDB power_in Side B ground, the ground reference for VDDB and the side B signals.
6 VI2 input Side B digital input for channel 2, which is transmitted to VO2 on side A (CA-IS3721).
7 VO1 output Side B digital output for channel 1, which follows VI1 from side A (CA-IS3721); output drive is 4 mA at 5 V and defaults high on the H version when input power or signal is lost.
8 VDDB power_in Side B power supply, operating range 2.375 V to 5.5 V relative to GNDB, with a 0.1 µF to 1 µF bypass capacitor.

Key specifications

Parameter Value
Manufacturer Chipanalog
Package SOIC-8-300mil
Category Interface ICs
Pins 8

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Supply Voltage VDDA, VDDB -0.5 6 V 5
Voltage at Ax, Bx, ENx Vin -0.5 V max VDDA+0.5, must not exceed 6 V 5
Output Current IO -20 20 mA 5
Junction Temperature TJ 150 °C 5
Storage Temperature TSTG -65 150 °C 5
ESD HBM VESD -4000 4000 V HBM per ANSI/ESDA/JEDEC JS-001, all pins 5
ESD CDM VESD -1000 1000 V CDM per JESD22-C101, all pins 5
Supply Voltage VDDA, VDDB 2.375 3.3 5.5 V 5
VDD Undervoltage Threshold Rising VDD(UVLO+) 1.95 2.24 2.375 V Supply voltage rising 5
VDD Undervoltage Threshold Falling VDD(UVLO-) 1.88 2.1 2.325 V Supply voltage falling 5
UVLO Hysteresis VHYS(UVLO) 70 140 250 mV 5
High-level Output Current IOH -4 mA VDDO = 5V 5
High-level Output Current IOH -2 mA VDDO = 3.3V 5
High-level Output Current IOH -1 mA VDDO = 2.5V 5
Low-level Output Current IOL 4 mA VDDO = 5V 5
Low-level Output Current IOL 2 mA VDDO = 3.3V 5
Low-level Output Current IOL 1 mA VDDO = 2.5V 5
High-level Input Voltage VIH 2 V 5
Low-level Input Voltage VIL 0.8 V 5
Data Rate DR 0 150 Mbps 5
Ambient Temperature TA -40 27 125 °C 5
Junction-to-ambient thermal resistance RθJA 92.3 °C/W G (SOIC) 8 pins 6
Junction-to-case(top) thermal resistance RθJC(top) 45.3 °C/W G (SOIC) 8 pins 6
Junction-to-board thermal resistance RθJB 50.5 °C/W G (SOIC) 8 pins 6
Junction-to-top characterization parameter ψJT 14 °C/W G (SOIC) 8 pins 6
Junction-to-board characterization parameter ψJB 49.3 °C/W G (SOIC) 8 pins 6
Maximum Power Dissipation PD 120 mW CA-IS3721; VDDA = VDDB = 5.5 V, CL = 15 pF, TJ = 150°C, 75-MHz 50% duty cycle square wave 6
Maximum Power Dissipation on Side-A PDA 60 mW CA-IS3721 6
Maximum Power Dissipation on Side-B PDB 60 mW CA-IS3721 6
Maximum withstanding isolation voltage VISO 5000 VRMS UL 1577; VTEST = VISO, t = 60 s; G package 7
Maximum repetitive peak isolation voltage VIORM 1414 VPK AC voltage (bipolar); G package 7
Maximum transient isolation voltage VIOTM 7070 VPK VTEST = VIOTM, t = 60 s; G package 7
High-level Output Voltage VOH 4.8 V VDD = 5 V ±10%; IOH = -4mA; min VDDO-0.4 9
High-level Output Voltage VOH 3.1 V VDD = 3.3 V ±10%; IOH = -4mA; min VDDO-0.4 9
High-level Output Voltage VOH 2.3 V VDD = 2.5 V ±5%; IOH = -4mA; min VDDO-0.4 9
Low-level Output Voltage VOL 0.2 0.4 V IOL = 4mA 9
Positive-going Input Threshold VIT+(IN) 1.4 1.67 1.9 V 9
Negative-going Input Threshold VIT-(IN) 1 1.23 1.4 V 9
Input Threshold Hysteresis VI(HYS) 0.3 0.44 0.5 V 9
High-Level Input Leakage Current IIH 4 µA VIH = VDDA at Ax or Bx or ENx 9
Low-Level Input Leakage Current IIL -4 µA VIL = 0 V at Ax or Bx 9
Output Impedance ZO 50 Ω 9
Common-mode Transient Immunity CMTI 75 100 kV/µS VI = VDDI or 0 V, VCM = 1200 V 9
Input Capacitance CI 2 pF VI = VDD/2 + 0.4×sin(2πft), f = 1 MHz, VDD = 5 V 9
Supply Current DC Signal Side A IDDA 1.3 2 mA CA-IS3721; VDD = 5 V ±10%; VIN = VDDI (CA-IS3721H) 10
Supply Current DC Signal Side B IDDB 1.3 2 mA CA-IS3721; VDD = 5 V ±10%; VIN = VDDI (CA-IS3721H) 10
Supply Current AC 100Mbps Side A IDDA 7 10.5 mA CA-IS3721; VDD = 5 V ±10%; 100Mbps (50MHz), CL = 15 pF each channel 10
Supply Current AC 100Mbps Side B IDDB 7 10.5 mA CA-IS3721; VDD = 5 V ±10%; 100Mbps (50MHz), CL = 15 pF each channel 10
Data Rate DR 0 150 Mbps 13
Minimum Pulse Width PWmin 5 ns 13
Propagation Delay Time tPLH, tPHL 5 8 13 ns See Figure 7-1 13
Pulse Width Distortion /tPLH - tPHL/ PWD 0.2 4.5 ns VDD = 5 V and 3.3 V; 2.5 V max 5.0 13
Channel-to-channel Output Skew Time tsk(o) 0.4 2.5 ns Same-direction 13
Part-to-part Skew Time tsk(pp) 2 4.5 ns VDD = 5 V and 3.3 V; 2.5 V max 5.0 13
Output Signal Rise Time tr 2.5 4 ns See Figure 7-1 13
Output Signal Fall Time tf 2.5 4 ns See Figure 7-1 13
Default Output Delay Time from Input Power Loss tDO 8 12 ns See Figure 7-2 13
Start-up Time tSU 15 40 µs 13
Pulse Width Distortion 2.5 V PWD 0.2 5 ns VDDA = VDDB = 2.5 V ±5% 13

CAD (KiCad official)

  • Symbol: CA-IS3721HG
  • Footprint: Package_SO:SOIC-8_3.9x4.9mm_P1.27mm
  • 3D model: SOIC-8-300mil (KiCad packages3D, STEP)
  • 3D model files: ca-is3721hg-etched.step / ca-is3721hg-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); ca-is3721hg.step / ca-is3721hg.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Chipanalog datasheet (22 pp, sha256 39fb33a8351462e1, retrieved 2026-10-22, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF