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Contents

README

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C8051F321-GMR

SILICON LABS · SILICON LABS · QFN-28-EP(5x5)

C8051F321-GMR from SILICON LABS, in a QFN-28-EP(5x5). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 P0.1 bidirectional Port 0.1 digital I/O pin, configurable through the crossbar as a port pin or peripheral signal.
2 P0.0 bidirectional Port 0.0 digital I/O pin, configurable through the crossbar as a port pin or peripheral signal.
3 GND power_in Ground reference for the device.
4 D+ bidirectional USB D+ data line for the integrated full-speed/low-speed USB transceiver.
5 D- bidirectional USB D- data line for the integrated full-speed/low-speed USB transceiver.
6 VDD power_in Power supply voltage input of 2.7-3.6 V; the datasheet also lists a 3.3 V voltage regulator output on this pin.
7 REGIN power_in 5 V regulator input to the on-chip voltage regulator.
8 VBUS power_in VBUS sense input connected to the USB VBUS signal; a 5 V signal on this pin indicates a USB connection.
9 /RST/C2CK bidirectional Device reset open-drain output of the POR or VDD monitor, which an external source can drive low for at least 15 µs; also the C2 debug interface clock.
10 P3.0/C2D bidirectional Port 3.0 GPIO pin that doubles as the bidirectional data signal for the C2 debug interface.
11 P2.3 bidirectional Port 2.3 digital I/O or analog input pin, available to the crossbar.
12 P2.2 bidirectional Port 2.2 digital I/O or analog input pin, available to the crossbar.
13 P2.1 bidirectional Port 2.1 digital I/O or analog input pin, available to the crossbar.
14 P2.0 bidirectional Port 2.0 digital I/O or analog input pin, available to the crossbar.
15 P1.7 bidirectional Port 1.7 digital I/O or analog input pin, available to the crossbar.
16 P1.6 bidirectional Port 1.6 digital I/O or analog input pin, available to the crossbar.
17 P1.5 bidirectional Port 1.5 digital I/O or analog input pin, available to the crossbar.
18 P1.4 bidirectional Port 1.4 digital I/O or analog input pin, available to the crossbar.
19 P1.3 bidirectional Port 1.3 digital I/O or analog input pin, available to the crossbar.
20 P1.2 bidirectional Port 1.2 digital I/O or analog input pin, available to the crossbar.
21 P1.1 bidirectional Port 1.1 digital I/O or analog input pin, available to the crossbar.
22 P1.0 bidirectional Port 1.0 digital I/O or analog input pin, available to the crossbar.
23 P0.7/VREF bidirectional Port 0.7 digital I/O pin that also serves as the external VREF input or output.
24 P0.6/CNVSTR bidirectional Port 0.6 digital I/O pin that also serves as the ADC0 external convert start input.
25 P0.5 bidirectional Port 0.5 digital I/O pin, configurable through the crossbar as a port pin or peripheral signal.
26 P0.4 bidirectional Port 0.4 digital I/O pin, configurable through the crossbar as a port pin or peripheral signal.
27 P0.3/XTAL2 bidirectional Port 0.3 digital I/O pin that serves as the external oscillator excitation driver for a crystal or resonator, or an external clock input.
28 P0.2/XTAL1 bidirectional Port 0.2 digital I/O pin that serves as the external oscillator return for a crystal or resonator, or an external clock input.
29 EP passive Exposed pad (from the footprint; not named in the datasheet pin table).

Key specifications

Parameter Value
Manufacturer SILICON LABS
Package QFN-28-EP(5x5)
Category Embedded Processors & Controllers
Pins 29

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Ambient temperature under bias -55 125 °C 29
Storage Temperature -65 150 °C 29
Voltage on any Port I/O Pin or /RST with respect to GND -0.3 5.8 V 29
Voltage on VDD with respect to GND -0.3 4.2 V 29
Maximum Total current through VDD and GND 500 mA 29
Maximum output current sunk by /RST or any Port pin 100 mA 29
Digital Supply Voltage VRST 3 3.6 V 30
Digital Supply RAM Data Retention Voltage 1.5 V 30
SYSCLK (System Clock) 0 25 MHz 30
TSYSH (SYSCLK High Time) TSYSH 18 ns 30
TSYSL (SYSCLK Low Time) TSYSL 18 ns 30
Specified Operating Temperature Range -40 85 °C 30
Digital Supply Current - CPU Active, IDD IDD 12.3 13.6 mA VDD = 3.6 V; F = 25 MHz 30
Digital Supply Current - CPU Active, IDD IDD 10.6 11.5 mA VDD = 3.3 V, F = 24 MHz 30
Digital Supply Current - CPU Active, IDD IDD 9 9.8 mA VDD = 3.0 V, F = 24 MHz 30
Digital Supply Current - CPU Idle, Idle IDD Idle IDD 5.8 6.5 mA VDD = 3.6 V; F = 25 MHz 30
Digital Supply Current - CPU Idle, Idle IDD Idle IDD 5.2 5.9 mA VDD = 3.3 V, F = 24 MHz 30
Digital Supply Current - CPU Idle, Idle IDD Idle IDD 4.6 5.2 mA VDD = 3.0 V, F = 24 MHz 30
Input Voltage Range 2.7 5.25 V 70
Output Voltage (VDD) VDD 3 3.3 3.6 V Output Current = 1 to 100 mA 70
Output Current 100 mA 70
VBUS Detection Input Low Voltage 1 V 70
VBUS Detection Input High Voltage 3 V 70
Dropout Voltage (VDO) VDO 1 mV/mA 70
Integral Nonlinearity -1 1 LSB 56
Differential Nonlinearity -1 1 LSB Guaranteed Monotonic 56
Offset Error -15 0 15 LSB 56
Full Scale Error -15 -1 15 LSB 56
Offset Temperature Coefficient 10 ppm/°C 56
Signal-to-Noise Plus Distortion SNDR 53 55.5 dB 10 kHz sine-wave Single-ended input, 1 dB below Full Scale, 200 ksps 56
Total Harmonic Distortion THD -67 dB Up to the 5th harmonic 56
Spurious-Free Dynamic Range SFDR 78 dB 56
SAR Conversion Clock 3 MHz 56
Conversion Time in SAR Clocks 10 clocks 56
Track/Hold Acquisition Time 300 ns 56
Throughput Rate 200 ksps 56
Input Capacitance 5 pF 56
Temperature Sensor Linearity 0.1 °C 56
Temperature Sensor Gain 2.86 mV/°C 56
Temperature Sensor Offset -8.5 0.776 8.5 mV Temp = 0 °C 56
Power Supply Current (VDD supplied to ADC0) 400 900 µA Operating Mode, 200 ksps 56
Power Supply Rejection -0.3 0.3 mV/V 56
Output Voltage 25 °C ambient (Internal Reference) 2.38 2.44 2.5 V 25 °C ambient 58
VREF Short-Circuit Current 10 mA 58
VREF Temperature Coefficient 15 ppm/°C 58
Load Regulation 1.5 ppm/µA Load = 0 to 200 µA to GND 58
VREF Turn-on Time 1 2 ms 4.7 µF tantalum, 0.1 µF ceramic bypass 58
VREF Turn-on Time 2 20 µs 0.1 µF ceramic bypass 58
VREF Turn-on Time 3 10 µs no bypass cap 58
Power Supply Rejection (VREF) 140 ppm/V 58
Input Current 12 µA Sample Rate = 200 ksps; VREF = 3.0 V 58
Response Time Mode 0 100 ns Mode 0, Vcm* = 1.5 V; CP0+, CP0- = 100 mV 68
Response Time Mode 0 250 ns Mode 0, Vcm* = 1.5 V; CP0+, CP0- = -100 mV 68
Response Time Mode 3 1050 ns Mode 3, Vcm* = 1.5 V; CP0+, CP0- = 100 mV 68
Response Time Mode 3 5200 ns Mode 3, Vcm* = 1.5 V; CP0+, CP0- = -100 mV 68
Common-Mode Rejection Ratio CMRR 1.5 4 mV/V 68
Positive Hysteresis 4 15 20 30 mV CP0HYP1-0 = 11 68
Negative Hysteresis 4 15 20 30 mV CP0HYN1-0 = 11 68
Inverting or Non-Inverting Input Voltage Range -0.25 V 68
Input Capacitance (Comparator) 3 pF 68
Input Offset Voltage -5 5 mV 68
Power-up Time 10 µs 68
Supply Current at DC Mode 0 7.6 20 µA Mode 0 68
Supply Current at DC Mode 3 0.4 2.5 µA Mode 3 68
/RST Output Low Voltage 0.6 V IOL = 8.5 mA, VDD = 2.7 V to 3.6 V 107
VDD POR Threshold VRST 2.4 2.55 2.7 V 107
Missing Clock Detector Timeout 100 220 500 µs Time from last system clock rising edge to reset initiation 107
Minimum /RST Low Time to Generate a System Reset 15 µs 107
Flash Size 16384 bytes 110
Erase Cycle Time 10 15 20 ms 25 MHz System Clock 110
Write Cycle Time 40 55 70 µs 25 MHz System Clock 110
Internal Oscillator Frequency 11.82 12 12.18 MHz Reset Frequency 128
USB Clock Frequency 47.88 48 48.12 MHz Full Speed Mode; applies only to external oscillator sources 128
USB Clock Frequency 5.91 6 6.09 MHz Low Speed Mode; applies only to external oscillator sources 128
Output Low Voltage 1 V IOL = 8.5 mA, Port I/O push-pull 141
Output Low Voltage 0.6 V IOL = 10 µA, Port I/O push-pull 141
Output Low Voltage 0.1 V IOL = 25 mA, Port I/O push-pull 141
Input High Voltage 2 V 141
Input Low Voltage 0.8 V 141
Output High Voltage VOH 2.8 V 172
Output Low Voltage VOL 0.8 V 172
Pull-up Resistance Full Speed (D+ Pull-up) RPU 1.425 1.5 1.575 kΩ Full Speed 172
Pull-up Resistance Low Speed (D- Pull-up) RPU 1.425 1.5 1.575 kΩ Low Speed 172
Output Rise Time TR 75 300 ns Low Speed 172
Output Rise Time TR 4 20 ns Full Speed 172
Output Fall Time TF 75 300 ns Low Speed 172
Output Fall Time TF 4 20 ns Full Speed 172
Differential Input Sensitivity VDI 0.2 V /(D+), (D-)/ 172
Differential Input Common Mode Range VCM 0.8 2.5 V 172
Input Leakage Current IL 1 µA Pullups Disabled 172

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
housing PC 4. Recommended card reflow profile is per the JEDEC/IPC J-STD￾020 specification for Small Body Components. 36

CAD (KiCad official)

  • Symbol: C8051F321-GMR
  • Footprint: Package_DFN_QFN:QFN-28-1EP_5x5mm_P0.5mm_EP3.35x3.35mm
  • 3D model: QFN-28-EP(5x5) (KiCad packages3D, STEP)
  • 3D model files: c8051f321-gmr-etched.step / c8051f321-gmr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); c8051f321-gmr.step / c8051f321-gmr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: SILICON LABS datasheet (254 pp, sha256 46143e2ba725954a, retrieved 2026-10-27, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF