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BZX84J-B39

Nexperia · Zener Diodes · SOD-323F

BZX84J-B39 from Nexperia, in a SOD-323F. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 cathode passive Cathode terminal, indicated by the marking bar; the device total power dissipation is 550 mW at Tamb 25 C with the cathode tab mounted on a 1 cm2 FR4 pad.
2 anode passive Anode terminal of the Zener diode; the device forward current is rated at 250 mA maximum (IF).

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-323F
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage VZ 38.2 39.8 V IZ = 2 mA 6
Tolerance (series B) -2 2 % 6
Differential resistance rdif 300 Ω IZ = 0.5 mA 6
Differential resistance rdif 75 Ω IZ = 2 mA 6
Reverse current IR 0.05 µA VR = 27.3 V 6
Temperature coefficient SZ 33.4 41.2 mV/K IZ = 2 mA 6
Diode capacitance Cd 58 pF f = 1 MHz; VR = 0 V 6
Non-repetitive peak reverse current IZSM 0.7 A tp = 100 µs; square wave; Tj = 25 °C prior to surge 6
Forward voltage VF 0.9 V IF = 10 mA 3
Forward voltage VF 1.1 V IF = 100 mA 3
Forward current IF 250 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C prior to surge 3
Total power dissipation Ptot 550 mW Tamb 25 C; device mounted on FR4 PCB, cathode pad 1 cm2 3
Junction temperature Tj 150 C 3
Ambient temperature Tamb -55 150 C 3
Storage temperature Tstg -65 150 C 3
Thermal resistance from junction to ambient Rth(j-a) 230 K/W in free air; device mounted on FR4 PCB, cathode pad 1 cm2 3
Thermal resistance from junction to solder point Rth(j-sp) 55 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZX84J-B39
  • Footprint: Diode_SMD:D_SOD-323F
  • 3D model: SOD-323F (KiCad packages3D, STEP)
  • 3D model files: bzx84j-b39-etched.step / bzx84j-b39-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84j-b39.step / bzx84j-b39.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 fcfb79c5f982558d, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF