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BZX84C75LT1G

onsemi · Zener Diodes · SOT-23

BZX84C75LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 ANODE passive Anode terminal of the Zener diode; the cathode is identified by the polarity band on the package, so pin 1 is the anode.
2 NO CONNECTION unconnected No connection; this pin is not connected internally and is listed as NO CONNECTION in the datasheet pinout.
3 CATHODE passive Cathode terminal of the Zener diode, marked by the polarity band; the BZX84C75LT1G has a nominal Zener voltage VZ of 75 V at IZT = 5 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ1 (nominal 75 V) VZ1 70 75 79 V @ IZT1 = 2 mA 3
Maximum Zener Impedance ZZT1 255 Ω @ IZT1 = 2 mA 3
Reverse Zener Voltage VZ2 VZ2 69.4 79 V @IZT2 = 0.1 mA 3
Maximum Zener Impedance ZZT2 500 Ω @ IZT4 = 0.5 mA 3
Reverse Zener Voltage VZ3 VZ3 70.3 80.2 V @IZT3 = 10 mA 3
Maximum Zener Impedance ZZT3 140 Ω @ IZT3 = 10 mA 3
Reverse Leakage Current IR 0.05 µA @ VR = 52.5 V 3
Maximum Temperature Coefficient of VZ VZ 73.4 88.6 mV/k @ IZT1 = 2 mA 3
Max Capacitance C 35 pF @ VR = 0, f = 1 MHz 3
Total Power Dissipation on FR-5 Board PD 250 mW @ TA = 25°C, FR-5 board (Note 1) 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RJA 500 °C/W FR-5 board (Note 1) 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C, alumina substrate (Note 2) 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RJA 417 °C/W alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C75LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c75lt1g-etched.step / bzx84c75lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c75lt1g.step / bzx84c75lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 b0f156e963b31101, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF