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BZX84C6V2-7-01-F

Public Made by Adom

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Diodes Incorporated Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZX84C6V2-7-01-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C6V2-7-01-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the 6.2V Zener diode (VZ 5.8V to 6.6V at IZT = 5mA), connected to the bottom-left terminal in the device schematic.
2 NC unconnected No internal connection; the device schematic shows no die connection to the bottom-right terminal.
3 K passive Cathode of the Zener diode, connected to the top terminal in the device schematic; maximum power dissipation is 350mW.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 5.8 6.2 6.6 V @ IZT = 5.0mA 2
Maximum Zener Impedance ZZT 10 Ω @ IZT = 5.0mA, f = 1KHz 2
Maximum Zener Impedance ZZK 150 Ω @ IZK = 1.0mA, f = 1KHz 2
Maximum Reverse Current IR 3 µA VR = 4.0V 2
Temperature Coefficient of Zener Voltage 0.4 3.7 mV/C @ IZT = 5.0mA 2
Forward Voltage VF 0.9 V IF = 10mA 2
Power Dissipation (Note 6) PD 300 mW TA = +25°C, Note 6 2
Power Dissipation (Note 7) PD 350 mW TA = +25°C, Note 7 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2
Thermal Resistance, Junction to Ambient Air (Note 6) RθJA 417 °C/W Note 6 2
Thermal Resistance, Junction to Ambient Air (Note 7) RθJA 357 °C/W Note 7 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BZX84C6V2-7-01-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c6v2-7-01-f-etched.step / bzx84c6v2-7-01-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c6v2-7-01-f.step / bzx84c6v2-7-01-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 70c346b571aa2f8b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF