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BZX84C68LT1G

onsemi · Zener Diodes · SOT-23-3

BZX84C68LT1G from onsemi, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the Zener diode; the cathode is identified by the polarity band on the package.
2 NC unconnected No internal connection; the pin is not connected to the Zener diode.
3 Cathode passive Cathode terminal of the Zener diode, marked by the polarity band, which sets the regulated reverse breakdown voltage (VZ 64 V min to 72 V max for BZX84C68LT1G).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ1 64 68 72 V @ IZT1 = 5 mA 3
Zener Impedance ZZT1 240 Ω @ IZT1 = 5 mA 3
Reverse Zener Voltage VZ2 63.4 72 V @ IZT2 = 1 mA 3
Zener Impedance ZZT2 475 Ω @ IZT2 = 1 mA 3
Reverse Zener Voltage VZ3 64.2 73.2 V @ IZT3 = 20 mA 3
Zener Impedance ZZT3 130 Ω @ IZT3 = 20 mA 3
Reverse Leakage Current IR 0.05 µA @ VR = 47.6 V 3
Max Capacitance C 35 pF @ VR = 0, f = 1 MHz 3
Forward Voltage VF 0.9 V @ IF = 10 mA 2
Total Power Dissipation on FR-5 Board PD 250 mW @ TA = 25°C (Note 1, FR-5 board) 2
Derating above 25°C (FR-5 board) PD 2 mW/°C Derated above 25°C (Note 1) 2
Thermal Resistance, Junction-to-Ambient (FR-5 board) RθJA 500 °C/W FR-5 board (Note 1) 2
Total Power Dissipation on Alumina Substrate PD 300 mW @ TA = 25°C (Note 2, alumina substrate) 2
Derating above 25°C (alumina substrate) PD 2.4 mW/°C Derated above 25°C (Note 2) 2
Thermal Resistance, Junction-to-Ambient (alumina substrate) RθJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C68LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: bzx84c68lt1g-etched.step / bzx84c68lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c68lt1g.step / bzx84c68lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 5a1a409db1310273, retrieved 2026-10-27, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus off (skipped (clean text read)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF