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BZX84C5V6LT3G

onsemi · Zener Diodes · SOT-23

BZX84C5V6LT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode (Style 8 pin 1); the Zener operates with reverse voltage applied from cathode to anode, VF = 0.90 V max at IF = 10 mA.
2 NC unconnected No connection (Style 8 pin 2).
3 Cathode passive Cathode of the Zener diode (Style 8 pin 3), indicated by the polarity band; BZX84C5V6 has VZ of 5.2 V min, 5.6 V nom, 6 V max at IZT = 5 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ1 VZ1 5.2 5.6 6 V IZT1 = 5 mA 3
Zener Voltage VZ2 VZ2 4.8 6 V IZT2 = 1 mA 3
Zener Voltage VZ3 VZ3 5.2 6.3 V IZT3 = 20 mA 3
Max Zener Impedance ZZT1 ZZT1 40 Ω IZT1 = 5 mA 3
Max Zener Impedance ZZT2 ZZT2 400 Ω IZT2 = 1 mA 3
Max Zener Impedance ZZT3 ZZT3 10 Ω IZT3 = 20 mA 3
Max Reverse Leakage Current IR 1 µA VR = 2 V 3
Temperature Coefficient of VZ θVZ -2 2.5 mV/K IZT1 = 5 mA 3
Capacitance C 0 200 pF VR = 0, f = 1 MHz 3
Forward Voltage VF 0.9 V IF = 10 mA 2
Total Power Dissipation on FR-5 Board PD 250 mW TA = 25°C, FR-5 board 2
Derating above 25°C (FR-5) PD 2 mW/°C FR-5 board, above 25°C 2
Total Power Dissipation on Alumina Substrate PD 300 mW TA = 25°C, alumina substrate 2
Derating above 25°C (Alumina) PD 2.4 mW/°C Alumina substrate, above 25°C 2
Thermal Resistance Junction-to-Ambient (FR-5) RθJA 500 °C/W FR-5 board 2
Thermal Resistance Junction-to-Ambient (Alumina) RθJA 417 °C/W Alumina substrate 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C5V6LT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c5v6lt3g-etched.step / bzx84c5v6lt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c5v6lt3g.step / bzx84c5v6lt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 5202fb7dde136c8b, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF