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BZX84C5V1LT3G

onsemi · Zener Diodes · SOT-23

BZX84C5V1LT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the Zener diode; the datasheet's STYLE 8 pinout assigns pin 1 as ANODE, opposite the cathode marked by the polarity band.
2 NC unconnected No connection (NO CONNECTION per STYLE 8); this pin is not connected internally and is not used in the circuit.
3 Cathode passive Cathode terminal of the Zener diode; the cathode is indicated by the polarity band on the SOT-23 package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ1 4.8 5.1 5.4 V @ IZT1 = 5 mA (Note 3) 3
Maximum Zener Impedance ZZT1 60 Ω @ IZT1 = 5 mA 3
Reverse Zener Voltage VZ2 4.2 5.3 V @ IZT2 = 1 mA (Note 3) 3
Maximum Zener Impedance ZZT2 480 Ω @ IZT2 = 1 mA 3
Reverse Zener Voltage VZ3 5 5.9 V @ IZT3 = 20 mA (Note 3) 3
Maximum Zener Impedance ZZT3 15 Ω @ IZT3 = 20 mA 3
Reverse Leakage Current IR 2 µA @ VR = 2 V 3
Maximum Temperature Coefficient of VZ VZ -2.7 1.2 mV/k @ IZT1 = 5 mA 3
Max. Capacitance C 225 pF @ VR = 0 and f = 1 MHz 3
Forward Voltage VF 0.9 V @ IF = 10 mA 3
Total Power Dissipation on FR-5 Board PD 250 mW Note 1, @ TA = 25°C 2
Derating above 25°C (FR-5 Board) 2 mW/°C Derated above 25°C, FR-5 Board (Note 1) 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RJA 500 °C/W FR-5 Board (Note 1) 2
Total Power Dissipation on Alumina Substrate PD 300 mW Note 2, @ TA = 25°C 2
Derating above 25°C (Alumina Substrate) 2.4 mW/°C Derated above 25°C, Alumina Substrate (Note 2) 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RJA 417 °C/W Alumina Substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C5V1LT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c5v1lt3g-etched.step / bzx84c5v1lt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c5v1lt3g.step / bzx84c5v1lt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 5a1a409db1310273, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF