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BZX84C4V7Q-13-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C4V7Q-13-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, the lower-left terminal in the top-view device schematic; forward voltage is 0.9 V max at IF = 10 mA.
2 NC unconnected No internal connection; the lower-right terminal in the device schematic has no connection to the die.
3 K passive Cathode of the zener diode, the single top terminal in the device schematic; for BZX84C4V7 the zener voltage is 4.4 V min to 5.0 V max at IZT = 5.0 mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (BZX84C4V7, nominal 4.7 V) VZ 4.4 4.7 5 V @ IZT = 5.0 mA 2
Maximum Zener impedance ZZT 80 Ω @ IZT = 5.0 mA, f = 1 kHz 2
Maximum Zener impedance (knee) ZZK 500 Ω @ IZK = 1.0 mA, f = 1 kHz 2
Maximum reverse current IR 3 µA @ VR = 2.0 V 2
Power dissipation (Note 6) PD 300 mW Note 6: FR-4 PC board with recommended pad layout 2
Power dissipation (Note 7) PD 350 mW Note 7: terminals kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2
Temperature coefficient 0.2 mV/C @ IZT 2
Forward voltage VF 0.9 V @ IF = 10mA 2
Thermal resistance, junction to ambient (Note 6) RθJA 417 °C/W Note 6: FR-4 PC board with recommended pad layout 2
Thermal resistance, junction to ambient (Note 7) RθJA 357 °C/W Note 7: terminals kept at ambient temperature 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BZX84C4V7Q-13-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c4v7q-13-f-etched.step / bzx84c4v7q-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c4v7q-13-f.step / bzx84c4v7q-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 70c346b571aa2f8b, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF