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BZX84C3V6Q-13-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C3V6Q-13-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Zener anode, the bottom-left terminal in the device schematic, connected through the diode symbol to the cathode on the top pin.
2 NC unconnected Bottom-right terminal, shown in the device schematic with no internal connection to the diode.
3 K passive Zener cathode, the single top terminal in the device schematic; BZX84C3V6 has VZ 3.4V to 3.8V at IZT = 5.0mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 3.6 V) range VZ 3.4 3.6 3.8 V @ IZT = 5.0 mA 2
Maximum Zener impedance ZZT 90 Ω f = 1KHz; @ IZT = 5.0 mA 2
Maximum Zener impedance (knee) ZZK 600 Ω @ IZK = 1.0 mA 2
Maximum reverse current IR 5 µA VR = 1.0 V 2
Temperature coefficient -3.5 0 mV/C @ IZT 2
Forward voltage VF 0.9 V @ IF = 10mA 2
Power dissipation (FR-4 pad layout, Note 6) PD 300 mW Note 6: FR-4 PC board, recommended pad layout 2
Power dissipation (terminals at ambient, Note 7) PD 350 mW Note 7: terminals kept at ambient temperature 2
Thermal resistance, junction to ambient air (Note 6) RθJA 417 °C/W Note 6: FR-4 PC board, recommended pad layout 2
Thermal resistance, junction to ambient air (Note 7) RθJA 357 °C/W Note 7: terminals kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BZX84C3V6Q-13-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c3v6q-13-f-etched.step / bzx84c3v6q-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c3v6q-13-f.step / bzx84c3v6q-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 70c346b571aa2f8b, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF