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Contents

README

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BZX84C3V3S-7-F

Diodes Incorporated · Zener Diodes · SOT-363

BZX84C3V3S-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 NC unconnected No connection internally, shown as NC at the bottom-left of the top-view device schematic.
2 A2 passive Anode of the second Zener diode (Zener voltage 3.1V to 3.5V at IZT = 5mA for the C3V3S).
3 C2 passive Cathode of the second Zener diode (Zener voltage 3.1V to 3.5V at IZT = 5mA for the C3V3S).
4 NC unconnected No connection internally, shown as NC at the top-right of the top-view device schematic.
5 A1 passive Anode of the first Zener diode (Zener voltage 3.1V to 3.5V at IZT = 5mA for the C3V3S).
6 C1 passive Cathode of the first Zener diode (Zener voltage 3.1V to 3.5V at IZT = 5mA for the C3V3S).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ 3.1 3.3 3.5 V @ IZT = 5 mA (Note 5, pulsed) 2
Maximum zener impedance ZZT 95 Ω @ IZT = 5 mA, f = 1 kHz (Note 6) 2
Maximum zener impedance at knee ZZK 600 Ω @ IZK = 1.0 mA 2
Maximum reverse current IR 5 uA @ VR = 1.0 V 2
Temperature coefficient of zener voltage -3.5 0 mV/°C @ IZT = 5 mA 2
Power dissipation PD 200 mW Note 1: FR4 PCB with recommended pad layout 1
Forward voltage VF 0.9 V @ IF = 10 mA 1
Operating and storage temperature range TJ, TSTG -65 150 °C 1
Thermal resistance, junction to ambient air RθJA 625 °C/W Note 1: FR4 PCB with recommended pad layout 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C3V3S-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363, generated on the KiCad land (body 1.25 x 2.1 mm, terminals on the pads, 0.95 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c3v3s-7-f-etched.step / bzx84c3v3s-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c3v3s-7-f.step / bzx84c3v3s-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 20ba77a2a153b024, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF