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BZX84C33Q-7-F

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Diodes Incorporated Zener Diodes, SOT-23-3. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZX84C33Q-7-F

Diodes Incorporated · Zener Diodes · SOT-23-3

BZX84C33Q-7-F from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, shown as the bottom-left terminal in the device schematic; BZX84C33 has Vz 31.0V to 35.0V at IZT = 2.0mA.
2 NC unconnected No internal connection; the bottom-right terminal in the device schematic has no diode connection.
3 K passive Cathode of the zener diode, shown as the single top terminal in the device schematic; maximum power dissipation is 350mW (Note 7).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 31 33 35 V @ IZT = 2.0 mA 2
Test Current IZT 2 mA Zener test current 2
Maximum Zener Impedance ZZT 80 Ω @ IZT, f = 1KHz 2
Maximum Zener Impedance (knee) ZZK 325 Ω @ IZK = 0.5 mA, f = 1KHz 2
Maximum Reverse Current IR 0.1 µA @ VR = 23.1 V 2
Temperature Coefficient 23.1 27.4 mV/C @ IZT 2
Forward Voltage VF 0.9 V @ IF = 10mA, TA = +25°C 2
Power Dissipation (Note 6) PD 300 mW Note 6 2
Power Dissipation (Note 7) PD 350 mW Note 7 2
Thermal Resistance, Junction to Ambient Air (Note 6) RθJA 417 °C/W Note 6 2
Thermal Resistance, Junction to Ambient Air (Note 7) RθJA 357 °C/W Note 7 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (KiCad official)

  • Symbol: BZX84C33Q-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3 (KiCad packages3D, STEP)
  • 3D model files: bzx84c33q-7-f-etched.step / bzx84c33q-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c33q-7-f.step / bzx84c33q-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 1ee9e1a294b45898, retrieved 2026-10-23, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF