component

BZX84C33LT1G

Public Made by Adom

by adom

onsemi Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZX84C33LT1G

onsemi · Zener Diodes · SOT-23

BZX84C33LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode terminal of the Zener diode; the cathode is identified by the polarity band on the package.
2 No Connection unconnected No internal connection; this pin is not connected to the device.
3 Cathode passive Cathode terminal of the Zener diode, indicated by the polarity band on the package.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ1 (nominal 33 V) VZ1 31 33 35 V @ IZT1 = 2 mA 3
Maximum Zener impedance ZZT1 ZZT1 80 Ω @ IZT1 = 2 mA 3
Zener voltage VZ2 VZ2 30.8 35 V @ IZT2 = 0.1 mA 3
Maximum Zener impedance ZZT2 ZZT2 325 Ω @ IZT4 = 0.5 mA 3
Zener voltage VZ3 VZ3 31.1 35.4 V @ IZT3 = 10 mA 3
Maximum Zener impedance ZZT3 ZZT3 55 Ω @ IZT3 = 10 mA 3
Maximum reverse leakage current IR 0.05 µA @ VR = 23.1 V 3
Maximum temperature coefficient of VZ VZ 27.4 33.4 mV/k @ IZT1 = 2 mA 3
Maximum capacitance C 70 pF @ VR = 0, f = 1 MHz 3
Forward voltage VF 0.9 V @ IF = 10 mA 2
Total power dissipation on FR-5 board PD 225 mW @ TA = 25°C, FR-5 board (Note 1) 2
Total power dissipation on alumina substrate PD 300 mW @ TA = 25°C, alumina substrate (Note 2) 2
Thermal resistance, junction-to-ambient, FR-5 board RJA 556 °C/W FR-5 board (Note 1) 2
Thermal resistance, junction-to-ambient, alumina substrate RJA 417 °C/W Alumina substrate (Note 2) 2
Junction and storage temperature range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C33LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c33lt1g-etched.step / bzx84c33lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c33lt1g.step / bzx84c33lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 efdb195d4f63280e, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF