main
History Download
Ray Publish 0.1.0 b891221

BZX84C2V4LT1G

onsemi · Zener Diodes · SOT-23

BZX84C2V4LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 ANODE passive Zener diode anode, shown as pin 1 in the SOT-23 Style 8 outline and the Electrical Characteristics pinout (1-Anode, 2-No Connection, 3-Cathode).
2 NC unconnected No connection, as stated in the datasheet pinout (2-No Connection) and the Style 8 outline.
3 CATHODE passive Zener diode cathode, identified by the polarity band on the package, per the datasheet pinout (3-Cathode).

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage (standard tolerance, min) VZ 2.2 2.4 2.6 V @ IZT1 = 5 mA 3
Zener Voltage at IZT2 (min/max) VZ 1.7 2.1 V @ IZT2 = 1 mA 3
Zener Voltage at IZT3 (min/max) VZ 2.6 3.2 V @ IZT3 = 20 mA 3
Maximum Zener Impedance at IZT1 ZZT1 100 Ω @ IZT1 = 5 mA 3
Maximum Zener Impedance at IZT2 ZZT2 600 Ω @ IZT2 = 1 mA 3
Maximum Zener Impedance at IZT3 ZZT3 50 Ω @ IZT3 = 20 mA 3
Maximum Reverse Leakage Current IR 50 μA @ VR = 1 V 3
Maximum Temperature Coefficient of VZ VZ -3.5 0 mV/k @ IZT1 = 5 mA 3
Max Capacitance C 450 pF @ VR = 0, f = 1 MHz 3
Total Power Dissipation on FR-5 Board @ TA = 25°C PD 250 mW @ TA = 25°C, FR-5 board (Note 1) 2
Total Power Dissipation on Alumina Substrate @ TA = 25°C PD 300 mW @ TA = 25°C, alumina substrate (Note 2) 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RθJA 500 °C/W FR-5 board (Note 1) 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RθJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C2V4LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c2v4lt1g-etched.step / bzx84c2v4lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c2v4lt1g.step / bzx84c2v4lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (9 pp, sha256 84b2a906a2980011, retrieved 2026-10-28, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF