main
History Download
Ray Publish 0.1.0 1fff35c

BZX84C27S-7-F

Diodes Incorporated · Zener Diodes · SOT-363

BZX84C27S-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 NC unconnected No connection, bottom-left pin in the top-view device schematic.
2 A2 passive Anode of Zener diode 2 (27V nominal, 25.1V to 28.9V at IZT = 2mA).
3 C2 passive Cathode of Zener diode 2 (27V nominal, 25.1V to 28.9V at IZT = 2mA).
4 NC unconnected No connection, top-right pin in the top-view device schematic.
5 A1 passive Anode of Zener diode 1 (27V nominal, 25.1V to 28.9V at IZT = 2mA).
6 C1 passive Cathode of Zener diode 1 (27V nominal, 25.1V to 28.9V at IZT = 2mA).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 27 V, range) VZ 25.1 27 28.9 V @ IZT = 2.0 mA (IZT column for KYA row) 2
Maximum Zener impedance ZZT 80 Ω @ IZT = 2.0 mA 2
Maximum Zener impedance (knee) ZZK 300 Ω @ IZK = 0.5 mA 2
Maximum reverse current IR 0.1 uA @ VR = 18.9 V 2
Temperature coefficient of Zener voltage 21.4 25.3 mV/°C @ IZT = 5mA (column header as printed) 2
Forward voltage VF 0.9 V @ IF = 10mA 1
Power dissipation PD 200 mW Note 1: mounted on FR4 PC board with recommended pad layout 1
Thermal resistance, junction to ambient air RθJA 625 °C/W Note 1: mounted on FR4 PC board with recommended pad layout 1
Operating and storage temperature range TJ, TSTG -65 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C27S-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363, generated on the KiCad land (body 1.25 x 2.1 mm, terminals on the pads, 0.95 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c27s-7-f-etched.step / bzx84c27s-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c27s-7-f.step / bzx84c27s-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 20ba77a2a153b024, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF