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BZX84C27Q-7-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84C27Q-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A passive Zener anode, the bottom-left terminal in the device schematic, which connects to the diode symbol (BZX84C27: VZ 25.1V to 28.9V at IZT = 2.0mA).
2 NC unconnected Bottom-right terminal in the device schematic, which has no internal connection to the diode.
3 K passive Zener cathode, the single top terminal in the device schematic, connected to the cathode bar of the diode.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 27 V; min/max for BZX84C27) VZ 25.1 27 28.9 V @ IZT = 2.0 mA 2
Maximum reverse current IR 0.1 µA @ VR = 18.9 V 2
Maximum Zener impedance ZZT 80 Ω @ IZT = 2.0 mA, f = 1 kHz 2
Maximum Zener impedance at knee ZZK 300 Ω @ IZK = 0.5 mA, f = 1 kHz 2
Temperature coefficient 21.4 mV/°C @ IZT = 2.0 mA 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Power dissipation (Note 6, FR-4 PCB with recommended pad layout) PD 300 mW Note 6 2
Power dissipation (Note 7, terminals kept at ambient temperature) PD 350 mW Note 7 2
Thermal resistance, junction to ambient air (Note 6) RθJA 417 °C/W Note 6 2
Thermal resistance, junction to ambient air (Note 7) RθJA 357 °C/W Note 7 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin  Terminals: Matte Tin Finish Annealed over Alloy 42 Leadframe (Lead Free Plating). Solderable per MIL-STD-202, Method 208 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84C27Q-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84c27q-7-f-etched.step / bzx84c27q-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c27q-7-f.step / bzx84c27q-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 1ee9e1a294b45898, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF