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BZX84C24S-7-F

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Diodes Incorporated Zener Diodes, SOT-363. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.

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BZX84C24S-7-F

Diodes Incorporated · Zener Diodes · SOT-363

BZX84C24S-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not connected internally; the datasheet's top-view device schematic labels this position NC.
2 A2 passive Anode of the second zener diode in the dual package; total device dissipation is limited to 200mW (mounted on FR4 with recommended pad layout).
3 C2 passive Cathode of the second zener diode; zener voltage range is 2.4V to 39V depending on the part number, with a forward voltage of 0.9V at 10mA.
4 NC unconnected Not connected internally; the datasheet's top-view device schematic labels this position NC.
5 A1 passive Anode of the first zener diode in the dual package; total device dissipation is limited to 200mW (mounted on FR4 with recommended pad layout).
6 C1 passive Cathode of the first zener diode; zener voltage range is 2.4V to 39V depending on the part number, with a forward voltage of 0.9V at 10mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 22.8 24 25.6 V @ IZT = 5 mA 2
Maximum Zener Impedance ZZT 70 Ω @ IZT = 5 mA 2
Maximum Zener Impedance ZZK 250 Ω @ IZK = 1.0 mA 2
Maximum Reverse Current IR 0.1 uA @ VR = 16.8 V 2
Temperature Coefficient of Zener Voltage 18.4 22 mV/°C @ IZT = 5 mA 2
Forward Voltage VF 0.9 V @ IF = 10 mA 1
Power Dissipation PD 200 mW Note 1: mounted on FR4 PC Board with recommended pad layout 1
Thermal Resistance, Junction to Ambient Air RθJA 625 °C/W Note 1: mounted on FR4 PC Board with recommended pad layout 1
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (KiCad official)

  • Symbol: BZX84C24S-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bzx84c24s-7-f-etched.step / bzx84c24s-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c24s-7-f.step / bzx84c24s-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 20ba77a2a153b024, retrieved 2026-10-17, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF