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BZX84C22LT1G

onsemi · Zener Diodes · SOT-23

BZX84C22LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode; the datasheet's SOT-23 Style 8 pinout assigns pin 1 as the anode, and the cathode is marked by a polarity band.
2 No Connection unconnected Pin 2 is not connected internally and is listed as 'No Connection' in the SOT-23 Style 8 pinout.
3 Cathode passive Cathode of the Zener diode; the datasheet's SOT-23 Style 8 pinout assigns pin 3 as the cathode, which is the terminal the polarity band marks.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Breakdown Voltage (nominal VZ, standard tolerance, IZT1) VZ1 20.8 22 23.3 V @ IZT1 = 5 mA 3
Zener Voltage (VZ2) VZ2 20.7 23.2 V @ IZT2 = 1 mA 3
Zener Voltage (VZ3) VZ3 20.9 23.4 V @ IZT3 = 20 mA 3
Maximum Zener Impedance (ZZT1) ZZT1 55 Ω @ IZT1 = 5 mA 3
Maximum Zener Impedance (ZZT2) ZZT2 250 Ω @ IZT2 = 1 mA 3
Maximum Zener Impedance (ZZT3) ZZT3 25 Ω @ IZT3 = 20 mA 3
Maximum Reverse Leakage Current IR 0.05 µA @ VR = 15.4 V 3
Maximum Temperature Coefficient of VZ (minimum column) VZ 16.4 20 mV/k @ IZT1 = 5 mA 3
Maximum Capacitance C 85 pF @ VR = 0 and f = 1 MHz 3
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2
Total Power Dissipation on FR−5 Board PD 250 mW on FR−5 Board, (Note 1) @ TA = 25°C 2
Derating above 25°C (FR−5 Board) PD 2 mW/°C Derated above 25°C, FR−5 Board 2
Total Power Dissipation on Alumina Substrate PD 300 mW on Alumina Substrate, (Note 2) @ TA = 25°C 2
Derating above 25°C (Alumina Substrate) PD 2.4 mW/°C Derated above 25°C, Alumina Substrate 2
Thermal Resistance, Junction-to-Ambient (FR−5 Board) RθJA 500 °C/W FR−5 Board, (Note 1) 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RθJA 417 °C/W Alumina Substrate, (Note 2) 2

CAD (KiCad official)

  • Symbol: BZX84C22LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c22lt1g-etched.step / bzx84c22lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c22lt1g.step / bzx84c22lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (7 pp, sha256 5a1a409db1310273, retrieved 2026-10-19, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF