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Contents

README

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BZX84C18LT3G

onsemi · Zener Diodes · SOT-23

BZX84C18LT3G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 Anode passive Anode of the Zener diode; the BZX84C18L has a Zener voltage of 16.8 V min to 19.1 V max (18 V nominal) at IZT1 = 5 mA.
2 NC unconnected No connection (Style 8, pinout 1-Anode, 2-No Connection, 3-Cathode).
3 Cathode passive Cathode of the Zener diode (marked by the polarity band); the maximum forward voltage is 0.90 V at IF = 10 mA.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 16.8 18 19.1 V IZT1 = 5 mA 3
Reverse Zener Voltage VZ 16.7 19 V IZT2 = 1 mA 3
Reverse Zener Voltage VZ 16.9 19.2 V IZT3 = 20 mA 3
Maximum Zener Impedance ZZT 45 Ω IZT1 = 5 mA 3
Maximum Zener Impedance ZZT 225 Ω IZT2 = 1 mA 3
Maximum Zener Impedance ZZT 20 Ω IZT3 = 20 mA 3
Reverse Leakage Current IR 0.05 µA VR = 12.6 V 3
Maximum Temperature Coefficient of VZ VZ 12.4 16 mV/°C IZT1 = 5 mA 3
Max Capacitance C 100 pF VR = 0, f = 1 MHz 3
Forward Voltage VF 0.9 V IF = 10 mA 3
Total Power Dissipation on FR-5 Board PD 250 mW FR-5 board, TA = 25°C; derate 2.0 mW/°C above 25°C 2
Thermal Resistance, Junction-to-Ambient (FR-5 Board) RθJA 500 °C/W FR-5 board 2
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate, TA = 25°C; derate 2.4 mW/°C above 25°C 2
Thermal Resistance, Junction-to-Ambient (Alumina Substrate) RθJA 417 °C/W Alumina substrate 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (KiCad official)

  • Symbol: BZX84C18LT3G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84c18lt3g-etched.step / bzx84c18lt3g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c18lt3g.step / bzx84c18lt3g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 5202fb7dde136c8b, retrieved 2026-11-08, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF