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Contents

README

markdown

BZX84C12S-7-F

Diodes Incorporated · Zener Diodes · SOT-363

BZX84C12S-7-F from Diodes Incorporated, in a SOT-363. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 NC unconnected Not connected; the datasheet top-view pinout shows this position as NC.
2 A2 passive Anode of Zener diode 2 in the dual-diode SOT-363 package, rated for 200 mW total power dissipation per the datasheet.
3 C2 passive Cathode of Zener diode 2 in the dual-diode SOT-363 package, rated for 200 mW total power dissipation per the datasheet.
4 NC unconnected Not connected; the datasheet top-view pinout shows this position as NC.
5 A1 passive Anode of Zener diode 1 in the dual-diode SOT-363 package, rated for 200 mW total power dissipation per the datasheet.
6 C1 passive Cathode of Zener diode 1 in the dual-diode SOT-363 package, rated for 200 mW total power dissipation per the datasheet.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-363
Category Diodes
Pins 6

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (BZX84C12S, nominal 12 V) VZ 11.4 12 12.7 V @ IZT = 5 mA; short pulse test 2
Maximum Zener impedance ZZT 25 Ω @ IZT = 5.0 mA, f = 1 kHz 2
Maximum Zener impedance (knee) ZZK 150 Ω @ IZK = 1.0 mA 2
Maximum reverse current IR 0.1 uA @ VR = 8.0 V 2
Temperature coefficient of Zener voltage 6 10 mV/°C @ IZT = 5 mA 2
Power dissipation PD 200 mW Mounted on FR4 PC board with recommended pad layout (Note 1) 1
Thermal resistance, junction to ambient air RθJA 625 °C/W Mounted on FR4 PC board with recommended pad layout (Note 1) 1
Operating and storage temperature range TJ, TSTG -65 150 °C 1

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 • Lead Free Plating (Matte Tin Finish annealed over Alloy 42 1

CAD (KiCad official)

  • Symbol: BZX84C12S-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-363_SC-70-6
  • 3D model: SOT-363 (KiCad packages3D, STEP)
  • 3D model files: bzx84c12s-7-f-etched.step / bzx84c12s-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84c12s-7-f.step / bzx84c12s-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (4 pp, sha256 20ba77a2a153b024, retrieved 2026-10-18, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF