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BZX84B5V6Q-13-F

Diodes Incorporated · Zener Diodes · SOT-23-3

BZX84B5V6Q-13-F from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A passive Anode of the Zener diode, shown on the bottom-left lead of the device schematic and connected internally to the cathode via the diode symbol.
2 NC unconnected No internal connection; the bottom-right lead is drawn with no connection in the device schematic.
3 K passive Cathode of the Zener diode, shown on the single top lead of the device schematic; this pin goes positive in Zener breakdown (VZ 5.49V to 5.71V at IZT = 5mA for the B5V6 type).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener Voltage VZ 5.49 5.6 5.71 V @ IZT = 5.0mA, TA=+25°C 2
Zener Voltage Tolerance -2 2 % ±2% Tolerance on VZ 1
Test Current IZT 5 mA 2
Maximum Zener Impedance ZZT 40 Ω @ IZT, f = 1KHz 2
Maximum Zener Impedance ZZK 400 Ω @ IZK = 1.0mA, f = 1KHz 2
Maximum Reverse Current IR 1 µA VR = 2.0V 2
Temperature Coefficient -2 2.5 mV/°C @ IZT 2
Forward Voltage VF 0.9 V IF = 10mA 2
Power Dissipation (Note 5) PD 300 mW Device mounted on FR-4 PCB with recommended pad layout 2
Power Dissipation (Note 6) PD 350 mW Valid provided the terminals are kept at ambient temperature 2
Thermal Resistance, Junction to Ambient Air (Note 5) RϴJA 417 °C/W FR-4 PCB with recommended pad layout 2
Thermal Resistance, Junction to Ambient Air (Note 6) RϴJA 357 °C/W Terminals kept at ambient temperature 2
Operating and Storage Temperature Range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84B5V6Q-13-F
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b5v6q-13-f-etched.step / bzx84b5v6q-13-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b5v6q-13-f.step / bzx84b5v6q-13-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 4d114424c6d8f3f6, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF