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BZX84B3V6-7-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84B3V6-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, the lower-left terminal in the device schematic, connected to the diode symbol.
2 NC unconnected Lower-right terminal, shown in the device schematic with no connection to the diode.
3 K passive Cathode of the zener diode, the single top terminal in the device schematic, which sets the zener voltage VZ (3.53V to 3.67V at IZT = 5mA for BZX84B3V6).

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal, min, max) VZ 3.53 3.6 3.67 V @ IZT = 5.0 mA; Note 7 short pulse test 2
Zener voltage tolerance VZ -2 2 % 1
Maximum Zener impedance ZZT 90 Ω f = 1KHz; @ IZT = 5.0 mA 2
Maximum Zener impedance ZZK 600 Ω f = 1KHz; @ IZK = 1.0 mA 2
Maximum reverse current IR 5 µA @ VR = 1.0 V; Note 7 short pulse test 2
Temperature coefficient -3.5 0 mV/°C @ IZT = 5.0 mA 2
Power dissipation PD 300 mW Note 5: FR-4 PCB with recommended pad layout 2
Power dissipation PD 350 mW Note 6: terminals kept at ambient temperature 2
Forward voltage VF 0.9 V @ IF = 10mA 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2
Thermal resistance, junction to ambient air RϴJA 417 °C/W Note 5: FR-4 PCB with recommended pad layout 2
Thermal resistance, junction to ambient air RϴJA 357 °C/W Note 6: terminals kept at ambient temperature 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). 1

CAD (KiCad official)

  • Symbol: BZX84B3V6-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23 (KiCad packages3D, STEP)
  • 3D model files: bzx84b3v6-7-f-etched.step / bzx84b3v6-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b3v6-7-f.step / bzx84b3v6-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 d7505f68264bd157, retrieved 2026-10-20, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF