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Contents

README

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BZX84B3V3-7-F

Diodes Incorporated · Zener Diodes · SOT-23

BZX84B3V3-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, the lower-left terminal in the device schematic; Vz is 3.3 V nominal (3.23 V to 3.37 V) at IZT = 5.0 mA.
2 NC unconnected Lower-right terminal in the device schematic, shown with no internal connection to the diode.
3 K passive Cathode of the zener diode, the single top terminal in the device schematic; it is positive with respect to the anode in reverse breakdown, and the power dissipation limit is 350 mW.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage VZ 3.23 3.3 3.37 V @ IZT = 5.0 mA 2
Maximum Zener impedance ZZT 95 Ω @ IZT = 5.0 mA, f = 1 KHz 2
Maximum Zener impedance ZZK 600 Ω @ IZK = 1.0 mA 2
Maximum reverse current IR 5 µA @ VR = 1.0 V 2
Temperature coefficient -3.5 0 mV/°C @ IZT = 5.0 mA 2
Forward voltage VF 0.9 V @ IF = 10 mA 2
Power dissipation (Note 5) PD 300 mW Note 5: device on FR-4 PCB with recommended pad layout 2
Power dissipation (Note 6) PD 350 mW Note 6: valid provided terminals are kept at ambient temperature 2
Thermal resistance, junction to ambient air (Note 5) RθJA 417 °C/W Note 5: device on FR-4 PCB with recommended pad layout 2
Thermal resistance, junction to ambient air (Note 6) RθJA 357 °C/W Note 6: terminals kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). 1

CAD (KiCad official)

  • Symbol: BZX84B3V3-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.025 mm tall, datasheet A, nominal). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b3v3-7-f-etched.step / bzx84b3v3-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b3v3-7-f.step / bzx84b3v3-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 d7505f68264bd157, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF