# BZX84B27

**MSKSEMI** · Zener Diodes · SOT-23

BZX84B27 from MSKSEMI, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

## Pinout

| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the 27V Zener diode (VZ 26.46-27.54V at IZT=2mA), per the SOT-23 pin configuration diagram. |
| 2 | NC | unconnected | Shown in the pin configuration diagram as an unconnected terminal with no internal connection to the diode. |
| 3 | K | passive | Cathode of the Zener diode, per the pin configuration diagram; power dissipation is 300mW maximum. |

## Key specifications

| Parameter | Value |
|---|---|
| Manufacturer | MSKSEMI |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |

## Electrical characteristics

Limits as printed in the datasheet (page.json `metadata.characteristics` carries them as data).

| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener Voltage (nominal) | VZ | 26.46 | 27 | 27.54 | V | @IZT=2 mA (row IZT) | 3 |
| Maximum Zener Impedance | ZZT |  |  | 80 | Ω | @IZT=2 mA (row IZT) | 3 |
| Maximum Zener Impedance | ZZK |  |  | 300 | Ω | @IZK=0.5 mA (row IZK) | 3 |
| Maximum Reverse Current | IR |  |  | 0.1 | μA | @VR=18.9 V (row VR) | 3 |
| Typical Temperature Coefficient |  | 21.4 |  | 25.3 | mV/°C | Table header: @IZT=5 mA | 3 |
| Forward Voltage | VF |  |  | 0.9 | V | @ IF = 10mA (Note 2: pulsed) | 2 |
| Power Dissipation | Pd |  |  | 300 | mW | Ta=25 ℃; Note 1: device terminals kept at ambient temperature | 2 |
| Thermal Resistance from Junction to Ambient | RθJA |  |  | 417 | ℃ /W | Ta=25 ℃ | 2 |
| Junction Temperature | Tj |  |  | 150 | ℃ | Ta=25 ℃ | 2 |
| Storage Temperature Range | Tstg | -55 |  | 150 | ℃ | Ta=25 ℃ | 2 |

## CAD (KiCad official)

- Symbol: `BZX84B27`
- Footprint: `Package_TO_SOT_SMD:SOT-23`
- 3D model: SOT-23 (KiCad packages3D, STEP)
- 3D model files: `bzx84b27-etched.step` / `bzx84b27-etched.glb` carry the MPN laser-etched on the die in a toggleable `Adom.LaserEtch` group (Fusion-ready); `bzx84b27.step` / `bzx84b27.glb` are the bare package body.

## Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

- **Datasheet:** [MSKSEMI datasheet](https://jlcpcb.com/api/file/downloadByFileSystemAccessId/8603119693804810240) (6 pp, sha256 `6b9c976e79ea5c0b`, retrieved 2026-10-18, tier: lcsc)
- **Extractor:** parts-factory `2.0.0` / `extract_pins 0.3`, primary `claude-sonnet-5-5` (text+vision), consensus `claude-opus-5-5` (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
- **CAD:** KiCad official libraries (CC-BY-SA 4.0).

[Datasheet PDF](docs/bzx84b27-datasheet.pdf)