component
BZX84B27-7-F
Public Made by Adomby adom
Diodes Incorporated Zener Diodes, SOT-23. Pinout cross-checked by two models against the datasheet, KiCad symbol/footprint/3D.
Generated by kicad-footprint-generator · KiCad file format 20260206
BZX84B27-7-F
Diodes Incorporated · Zener Diodes · SOT-23
BZX84B27-7-F from Diodes Incorporated, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.
Pinout
| Pin | Name | Type | Function |
|---|---|---|---|
| 1 | A | passive | Anode of the zener diode, the bottom-left terminal in the top-view device schematic. |
| 2 | NC | unconnected | No internal connection; the bottom-right terminal is shown without a connection in the device schematic. |
| 3 | K | passive | Cathode of the zener diode, the single top terminal in the device schematic, which goes positive relative to the anode in zener breakdown (VZ 26.5V to 27.5V at IZT 2.0mA for BZX84B27). |
Key specifications
| Parameter | Value |
|---|---|
| Manufacturer | Diodes Incorporated |
| Package | SOT-23 |
| Category | Diodes |
| Pins | 3 |
Electrical characteristics
Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).
| Parameter | Symbol | Min | Typ | Max | Unit | Conditions | Page |
|---|---|---|---|---|---|---|---|
| Zener Voltage (nominal) | VZ | 27 | V | @ IZT = 2.0mA | 2 | ||
| Zener Voltage Range | VZ | 26.5 | 27.5 | V | @ IZT = 2.0mA | 2 | |
| Zener Test Current | IZT | 2 | mA | 2 | |||
| Maximum Zener Impedance | ZZT | 80 | Ω | @ IZT, f = 1KHz | 2 | ||
| Maximum Zener Impedance (knee) | ZZK | 300 | Ω | @ IZK = 0.5mA, f = 1KHz | 2 | ||
| Maximum Reverse Current | IR | 0.1 | µA | VR = 18.9V | 2 | ||
| Temperature Coefficient | 21.4 | 25.3 | mV/°C | @ IZT | 2 | ||
| Forward Voltage | VF | 0.9 | V | IF = 10mA | 2 | ||
| Power Dissipation (Note 5) | PD | 300 | mW | Device mounted on FR-4 PCB with recommended pad layout | 2 | ||
| Power Dissipation (Note 6) | PD | 350 | mW | Valid provided the terminals are kept at ambient temperature | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 5) | RϴJA | 417 | °C/W | Device mounted on FR-4 PCB with recommended pad layout | 2 | ||
| Thermal Resistance, Junction to Ambient (Note 6) | RϴJA | 357 | °C/W | Valid provided the terminals are kept at ambient temperature | 2 | ||
| Operating and Storage Temperature Range | TJ, TSTG | -65 | 150 | °C | 2 | ||
| Zener Voltage Tolerance | VZ | -2 | 2 | % | B grade | 1 |
Materials and finish
As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).
| Part | Material | Colour / plating | Datasheet says | Page |
|---|---|---|---|---|
| contacts | tin | • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). | 1 |
CAD (land: KiCad; 3D: generated from the datasheet)
- Symbol:
BZX84B27-7-F - Footprint:
Package_TO_SOT_SMD:SOT-23 - 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
- 3D model files:
bzx84b27-7-f-etched.step/bzx84b27-7-f-etched.glbcarry the MPN laser-etched on the die in a toggleableAdom.LaserEtchgroup (Fusion-ready);bzx84b27-7-f.step/bzx84b27-7-f.glbare the bare package body.
Provenance
Data extracted from the manufacturer datasheet, not a distributor listing:
- Datasheet: Diodes Incorporated datasheet (5 pp, sha256
d7505f68264bd157, retrieved 2026-11-13, tier: manufacturer) - Extractor: parts-factory
2.0.0/extract_pins 0.3, primaryclaude-sonnet-5-5(text+vision), consensusclaude-opus-5-5(agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish. - CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).