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BZX84B24Q-7-F

Diodes Incorporated · Zener Diodes · SOT-23-3

BZX84B24Q-7-F from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, shown on the bottom-left terminal of the device schematic; the BZX84B24 has a nominal VZ of 24V (23.5V to 24.5V) at IZT = 5.0mA.
2 NC unconnected Bottom-right terminal, drawn with no internal connection in the device schematic.
3 K passive Cathode of the zener diode, shown on the single top terminal of the device schematic; it is the positive side in reverse breakdown, with a power dissipation of 350mW.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (nominal 24 V, KY9 variant) VZ 23.5 24 24.5 V @ IZT = 5.0 mA 2
Maximum Zener impedance ZZT 70 Ω @ IZT = 5.0 mA, f = 1 KHz 2
Maximum Zener impedance (knee) ZZK 250 Ω @ IZK = 1.0 mA 2
Maximum reverse current IR 0.1 µA @ VR = 16.8 V 2
Temperature coefficient TC 18.4 22 mV/°C @ IZT = 5.0 mA 2
Power dissipation (Note 6) PD 350 mW Note 6: valid provided the terminals are kept at ambient temperature 2
Power dissipation (Note 5) PD 300 mW Note 5: device mounted on FR-4 PCB with recommended pad layout 2
Thermal resistance, junction to ambient air (Note 5) RθJA 417 °C/W Note 5: device mounted on FR-4 PCB with recommended pad layout 2
Thermal resistance, junction to ambient air (Note 6) RθJA 357 °C/W Note 6: terminals kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C Operating and storage 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). 1

CAD (KiCad official)

  • Symbol: BZX84B24Q-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated from the KiCad footprint (body from the F.Fab outline, terminals on the pads, 1.025 mm tall, datasheet A, nominal). Neither the vendor nor KiCad ships a 3D model for this package, so the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b24q-7-f-etched.step / bzx84b24q-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b24q-7-f.step / bzx84b24q-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 4d114424c6d8f3f6, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF