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BZX84B13Q-7-F

Diodes Incorporated · Zener Diodes · SOT-23-3

BZX84B13Q-7-F from Diodes Incorporated, in a SOT-23-3. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A passive Anode of the zener diode, shown at the bottom-left lead in the device schematic; it is the positive-current-return side when the diode operates in reverse breakdown.
2 NC unconnected No internal connection; the bottom-right lead has no connection in the device schematic.
3 K passive Cathode of the zener diode, shown at the single top lead in the device schematic; for BZX84B13 the zener voltage is 12.7V to 13.3V at IZT = 5.0mA.

Key specifications

Parameter Value
Manufacturer Diodes Incorporated
Package SOT-23-3
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Zener voltage (13 V nominal) VZ 12.7 13 13.3 V @ IZT = 5.0 mA 2
Maximum zener impedance ZZT 30 Ω @ IZT = 5.0 mA, f = 1 KHz 2
Maximum zener impedance ZZK 170 Ω @ IZK = 1.0 mA, f = 1 KHz 2
Maximum reverse current IR 0.1 µA @ VR = 8.0 V 2
Temperature coefficient 7 11 mV/°C @ IZT = 5.0 mA 2
Forward voltage VF 0.9 V @ IF = 10mA 2
Power dissipation PD 300 mW Note 5: device on FR-4 PCB with recommended pad layout 2
Power dissipation PD 350 mW Note 6: valid provided the terminals are kept at ambient temperature 2
Thermal resistance, junction to ambient air RϴJA 417 °C/W Note 5: device on FR-4 PCB with recommended pad layout 2
Thermal resistance, junction to ambient air RϴJA 357 °C/W Note 6: valid provided the terminals are kept at ambient temperature 2
Operating and storage temperature range TJ, TSTG -65 150 °C 2

Materials and finish

As the datasheet states them (page.json metadata.appearance; the 3D model's colours follow it).

Part Material Colour / plating Datasheet says Page
contacts tin • Terminals: Solderable per MIL-STD-202, Method 208 Lead-Free Plating (Matte Tin Finish Annealed over Alloy 42 Leadframe). 1

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84B13Q-7-F
  • Footprint: Package_TO_SOT_SMD:SOT-23-3
  • 3D model: SOT-23-3, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.025 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b13q-7-f-etched.step / bzx84b13q-7-f-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b13q-7-f.step / bzx84b13q-7-f.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Diodes Incorporated datasheet (5 pp, sha256 4d114424c6d8f3f6, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-sonnet-5-5 (text+vision), consensus claude-opus-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF