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BZX84B10LT1G

onsemi · Zener Diodes · SOT-23

BZX84B10LT1G from onsemi, in a SOT-23. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 ANODE passive Anode terminal of the Zener diode; the datasheet's STYLE 8 pin assignment for SOT-23 places the anode on pin 1.
2 NC unconnected No internal connection; the datasheet specifies pin 2 as NO CONNECTION for this package style.
3 CATHODE passive Cathode terminal of the Zener diode, marked by the polarity band on the package; the datasheet's STYLE 8 pin assignment places the cathode on pin 3.

Key specifications

Parameter Value
Manufacturer onsemi
Package SOT-23
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Reverse Zener Voltage VZ 9.8 10 10.2 V @ IZT = 5 mA (Note 4) 4
Maximum Zener Impedance ZZT 20 Ω @ IZT = 5 mA (Note 4) 4
Reverse Leakage Current IR 0.2 µA @ VR = 7 V 4
Temperature Coefficient of VZ VZ 4.5 8 mV/k @ IZT = 5 mA 4
Max. Capacitance C 130 pF @ VR = 0, f = 1 MHz 4
Forward Voltage VF 0.9 V @ IF = 10 mA 4
Total Power Dissipation on FR-5 Board PD 250 mW FR-5 board (Note 1) @ TA = 25°C 2
Total Power Dissipation on Alumina Substrate PD 300 mW Alumina substrate (Note 2) @ TA = 25°C 2
Power Dissipation Derating above 25°C, FR-5 Board 2 mW/°C FR-5 board, derated above 25°C 2
Power Dissipation Derating above 25°C, Alumina Substrate 2.4 mW/°C Alumina substrate, derated above 25°C 2
Thermal Resistance, Junction-to-Ambient, FR-5 Board RJA 500 °C/W FR-5 board (Note 1) 2
Thermal Resistance, Junction-to-Ambient, Alumina Substrate RJA 417 °C/W Alumina substrate (Note 2) 2
Junction and Storage Temperature Range TJ, Tstg -65 150 °C 2

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX84B10LT1G
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, nominal). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx84b10lt1g-etched.step / bzx84b10lt1g-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84b10lt1g.step / bzx84b10lt1g.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: onsemi datasheet (8 pp, sha256 b0f156e963b31101, retrieved 2026-11-13, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF