Loads when you scroll to it. Unloads after 5 minutes in the background.

Symbol & Footprint

Schematic Symbol

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.

PCB Footprint

Open full view ↗
Loads when you scroll to it. Unloads after 5 minutes in the background.
Loads when you scroll to it. Unloads after 5 minutes in the background.
Download PDF
Contents

README

markdown

BZX8450-C9V1-QR

Nexperia · Zener Diodes · TO-236AB

BZX8450-C9V1-QR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the voltage regulator diode; the datasheet gives no additional pin-level limits for this terminal.
2 n.c. unconnected Not connected internally and not used in the circuit.
3 K passive Cathode of the voltage regulator diode; the thermal table refers to the soldering point of the cathode tab for thermal resistance.

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-236AB
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (9V1-Q row) VZ 8.65 9.56 V Tj = 25 °C unless otherwise specified 4
Diode capacitance (9V1-Q row) Cd 150 pF f = 1 MHz; VR = 0 V 4
Temperature coefficient (9V1-Q row) SZ 3.8 7 mV/K 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Working voltage tolerance (series) -5 5 % Tolerance series, approximately ±5 % 1
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C; prior to surge 3
Total power dissipation Ptot 250 mW Tamb ≤ 25 °C; device mounted on FR4 PCB, single sided copper, tin-plated and standard footprint 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 500 K/W in free air; device mounted on FR4 PCB, single sided copper, tin-plated and standard footprint 3
Thermal resistance from junction to solder point Rth(j-sp) 330 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZX8450-C9V1-QR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: TO-236AB (KiCad packages3D, STEP)
  • 3D model files: bzx8450-c9v1-qr-etched.step / bzx8450-c9v1-qr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx8450-c9v1-qr.step / bzx8450-c9v1-qr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (10 pp, sha256 c4eaf3bb5a88aca0, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF