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BZX8450-C3V9-QR

Nexperia · Zener Diodes · TO-236AB

BZX8450-C3V9-QR from Nexperia, in a TO-236AB. Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model). Symbol and footprint from KiCad-official CAD; the 3D model is generated from the datasheet's package dimensions.

Pinout

Pin Name Type Function
1 A passive Anode of the low-current voltage regulator diode; the datasheet gives no separate electrical limit for this pin.
2 n.c. unconnected Pin 2 is not connected internally and is not used in the circuit.
3 K passive Cathode of the low-current voltage regulator diode; the cathode tab is the soldering point referenced for thermal resistance junction-to-solder point (Rth(j-sp) 330 K/W max).

Key specifications

Parameter Value
Manufacturer Nexperia
Package TO-236AB
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (BZX8450-C3V9-Q) VZ 3.7 4.1 V Tj = 25 °C 4
Temperature coefficient (BZX8450-C3V9-Q) SZ -2.7 2.5 mV/K Tj = 25 °C 4
Differential resistance (BZX8450-C3V9-Q) rdiff 600 Ω IZ = 50 µA; Tj = 25 °C 4
Differential resistance (BZX8450-C3V9-Q) rdiff 95 Ω IZ = 1 mA; Tj = 25 °C 4
Differential resistance (BZX8450-C3V9-Q) rdiff 5 Ω IZ = 5 mA; Tj = 25 °C 4
Diode capacitance (BZX8450-C3V9-Q) Cd 150 pF f = 1 MHz; VR = 0 V 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 µs; δ ≤ 0.02 4
Working voltage tolerance series (approximate) -5 5 % approximately ±5 %, series tolerance as stated in Features 1
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tj = 25 °C; prior to surge 3
Total power dissipation Ptot 250 mW Tamb ≤ 25 °C; device mounted on FR4 PCB, single sided copper, tin-plated, standard footprint 3
Junction temperature Tj 150 °C 3
Ambient temperature Tamb -55 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance from junction to ambient Rth(j-a) 500 K/W in free air; device mounted on FR4 PCB, single sided copper, tin-plated, standard footprint 3
Thermal resistance from junction to solder point Rth(j-sp) 330 K/W soldering point of cathode tab 3

CAD (land: KiCad; 3D: generated from the datasheet)

  • Symbol: BZX8450-C3V9-QR
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: TO-236AB, generated on the KiCad land (body 1.3 x 2.9 mm, terminals on the pads, 1.0 mm tall, datasheet A, midpoint of min and max). KiCad's stock model for this land is taller than the datasheet allows, so the model is generated from the datasheet drawing; the dimensions come from the datasheet drawing where it was read and are defaults otherwise (see provenance.model_3d_generated), not the manufacturer's CAD (STEP)
  • 3D model files: bzx8450-c3v9-qr-etched.step / bzx8450-c3v9-qr-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx8450-c3v9-qr.step / bzx8450-c3v9-qr.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (10 pp, sha256 c4eaf3bb5a88aca0, retrieved 2026-11-12, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: land: KiCad official libraries (CC-BY-SA 4.0); 3D: generated from the datasheet's package dimensions (provenance.model_3d_generated).

Datasheet PDF