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Contents

README

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BZX84-A3V3

Nexperia · Zener Diodes · SOT-23(TO-236AB)

BZX84-A3V3 from Nexperia, in a SOT-23(TO-236AB). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 A passive Anode of the voltage regulator diode; the datasheet gives no pin-specific limits beyond the device ratings.
2 n.c. unconnected Not connected internally; the datasheet specifies no function for this pin.
3 K passive Cathode of the voltage regulator diode; the datasheet gives no pin-specific limits beyond the device ratings.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOT-23(TO-236AB)
Category Diodes
Pins 3

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (BZX84-A3V3) VZ 3.26 3.34 V IZ = 5 mA 5
Working voltage tolerance (A series, E24) -1 1 % BZX84-A series, E24 ±1 % 1
Maximum differential resistance rdif 600 Ω IZ = 1 mA 5
Maximum differential resistance rdif 95 Ω IZ = 5 mA 5
Reverse current IR 5 μA Max VR (V) = 1 5
Temperature coefficient SZ -3.5 mV/K IZ = 5 mA 5
Temperature coefficient SZ 0 mV/K IZ = 5 mA 5
Diode capacitance Cd 450 pF f = 1 MHz; VR = 0 V 5
Non-repetitive peak reverse current IZSM 6 A tp = 100 μs; square wave; Tj = 25 °C 5
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 100 μs; δ ≤ 0.02 4
Forward current IF 200 mA 4
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 μs; square wave; Tj = 25 °C prior to surge 4
Total power dissipation Ptot 250 mW Tamb ≤ 25 °C; device mounted on FR4 PCB, single-sided 70 µm copper, standard footprint 4
Junction temperature Tj 150 °C 4
Ambient temperature Tamb -55 150 °C 4
Storage temperature Tstg -65 150 °C 4
Thermal resistance from junction to ambient Rth(j-a) 500 K/W in free air; device mounted on FR4 PCB, single-sided 70 µm copper, tin-plated, standard footprint 4
Thermal resistance from junction to solder point Rth(j-sp) 330 K/W Soldering point of cathode tab 4

CAD (KiCad official)

  • Symbol: BZX84-A3V3
  • Footprint: Package_TO_SOT_SMD:SOT-23
  • 3D model: SOT-23(TO-236AB) (KiCad packages3D, STEP)
  • 3D model files: bzx84-a3v3-etched.step / bzx84-a3v3-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx84-a3v3.step / bzx84-a3v3.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (14 pp, sha256 e6278027e055c1b0, retrieved 2026-10-16, tier: lcsc)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF