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BZX585-C3V9

Nexperia · Zener Diodes · SOD-523(SC-79)

BZX585-C3V9 from Nexperia, in a SOD-523(SC-79). Pinout and pin descriptions extracted from the manufacturer datasheet (extract_pins, cross-checked by a second model); symbol, footprint, and 3D from KiCad-official CAD.

Pinout

Pin Name Type Function
1 K passive Cathode of the Zener diode; the marking bar on the package indicates the cathode.
2 A passive Anode of the Zener diode.

Key specifications

Parameter Value
Manufacturer Nexperia
Package SOD-523(SC-79)
Category Diodes
Pins 2

Electrical characteristics

Limits as printed in the datasheet (page.json metadata.characteristics carries them as data).

Parameter Symbol Min Typ Max Unit Conditions Page
Working voltage (C grade) VZ 3.71 4.1 V 4
Differential resistance rdiff 85 90 Ω IZ = 5 mA 4
Differential resistance rdiff 400 500 Ω IZ = 1 mA 4
Temperature coefficient SZ -3.5 -1.9 0 mV/K IZ = 5 mA 4
Reverse current IR 3 µA IZ = 5 mA; VR = 1.0 V 4
Diode capacitance Cd 370 pF f = 1 MHz; VR = 0 V 4
Non-repetitive peak reverse current IZSM 6 A tp = 100 µs; square wave; Tj = 25 °C before surge 4
Tolerance (C series) -5 5 % 4
Forward voltage VF 0.9 V IF = 10 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward voltage VF 1.1 V IF = 100 mA; pulse test tp ≤ 300 μs; δ ≤ 0.02 4
Forward current IF 200 mA 3
Non-repetitive peak reverse power dissipation PZSM 40 W tp = 100 µs; square wave; Tamb = 25 °C; prior to surge 3
Total power dissipation Ptot 300 mW Tamb = 25 °C; device mounted on FR4 PCB, ~35 mm2 Cu at cathode tab 3
Junction temperature Tj -65 150 °C 3
Ambient temperature Tamb -65 150 °C 3
Storage temperature Tstg -65 150 °C 3
Thermal resistance junction to ambient Rth(j-a) 350 K/W in free air; device mounted on FR4 PCB 3
Thermal resistance junction to solder point Rth(j-sp) 65 K/W soldering point of cathode tab 3

CAD (KiCad official)

  • Symbol: BZX585-C3V9
  • Footprint: Diode_SMD:D_SOD-523
  • 3D model: SOD-523(SC-79) (KiCad packages3D, STEP)
  • 3D model files: bzx585-c3v9-etched.step / bzx585-c3v9-etched.glb carry the MPN laser-etched on the die in a toggleable Adom.LaserEtch group (Fusion-ready); bzx585-c3v9.step / bzx585-c3v9.glb are the bare package body.

Provenance

Data extracted from the manufacturer datasheet, not a distributor listing:

  • Datasheet: Nexperia datasheet (13 pp, sha256 ce6f045443a822c0, retrieved 2026-10-26, tier: manufacturer)
  • Extractor: parts-factory 2.0.0 / extract_pins 0.3, primary claude-haiku-5-5 (text), consensus claude-sonnet-5-5 (agreed (audit)), guards: pin_guards 0.1: passed. Pins are checked against the footprint pad set and their cited datasheet pages before publish.
  • CAD: KiCad official libraries (CC-BY-SA 4.0).

Datasheet PDF